Substrates were fabricated by replica molding of polydimethylsiloxane (PDMS; Dow Corning, Midland, MI, USA). The molds were made on silicone wafers by standard photolithography using a positive photoresist (AZ4562; Microchemicals GmbH, Germany), deposited up to the desired thickness for both configurations. After development, resist was reflown on a hotplate at 250°C for 30 minutes to achieve round-shaped posts. The final molds were then cast by pouring fresh PDMS onto the wafer molds, cured at 70°C for 3 hours, peeled off, and silanized to aid subsequent releases. The steps of the process are depicted in Figure 1 .
Az4562
Manufactured by MicroChemicals
Sourced in Germany, Israel
The AZ4562 is a positive photoresist designed for use in the microelectronics industry. It is a liquid polymer-based material that is applied to a substrate and exposed to ultraviolet light through a photomask to create a desired pattern. The exposed areas become more soluble, allowing them to be selectively removed during the development process, leaving behind the unexposed areas as a protective layer.
Automatically generated - may contain errors
Lab products found in correlation
Az 4533, by MicroChemicals (1 mentions)
Tetramethylammonium hydroxide, by Merck Group (1 mentions)
1 hydroxybenzotriazole, by Merck Group (1 mentions)
N n diisopropylcarbodiimide, by Merck Group (1 mentions)
Pmma a4, by MicroChem (1 mentions)
Lor5a, by MicroChem (1 mentions)
Anthraquinone 2 carboxylic acid, by Merck Group (1 mentions)
Phosphate buffered saline (pbs), by Merck Group (1 mentions)
D glucose, by Merck Group (1 mentions)
Sodium l lactate, by Merck Group (1 mentions)
4 protocols using az4562
1
PDMS Substrate Fabrication by Replica Molding
2
Fabrication of Silicon Wafer Devices
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Silicon wafer was purchased from UniversityWafer, Inc. (Boston, MA, USA), polytetrafluoroethylene tubing from Wirtham Marketing & Suppliers (Haifa, Israel), and AZ 4533® and AZ 4562® photoresists from MicroChemicals GmbH (Ulm, Germany). The mask made of quartz coated with a thin layer of chromium was designed by using AutoCAD® 22.0 software (Autodesk, Inc., San Rafael, CA, USA).
3
Fabrication of Glucose Sensing Hydrogels
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The following chemicals
were supplied by Sigma-Aldrich (now MERCK): phosphate buffered saline
(PBS), N,N′-diisopropylcarbodiimide
(DIC), 1-hydroxybenzotriazole (HOBt), Anthraquinone-2-carboxylic acid
(AQCA),d -glucose (GLU), PEG-diacrylate Mn575 (PEGDA), pentaerythritol
tetraacrylate, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (DTPO),
agar (A1296 powder), tetrakis(dimethylamido) hafnium(IV), glucose
oxidase (GOX; G2133), N,N-diethylhydroxylamine
(DEHA), sodium l-lactate (LAC), and tetramethylammonium hydroxide
(TMAH). Dimethyl sulfoxide (DMSO), hydrogen peroxide (H2O2), and sulfuric acid were supplied by Biolab. N-Methyl-2-pyrrolidone (NMP), acetone, and 2-isopropanol
(IPA) were supplied by J.T Baker. LOR5A, SF15, PMMA A4, and MMA el6
were supplied by Microchem (now Kayaku Advanced Materials). Lactate
oxidase was from A.G Scientific. Hexamethyldisilazane (HMDS), AZ1505,
and AZ4562 were supplied by Microchemicals. (3-Aminopropyl)-dimethyl-ethoxysilane
was supplied by Gelest. SOI and Si wafers were supplied by SOITEC
and University Wafers (device layer 50 nm 10 Ω per cm, BOX 150
nm, handle 725 μm, 10 Ω per cm, both handle and device
layers were ⟨0-0-1⟩).
were supplied by Sigma-Aldrich (now MERCK): phosphate buffered saline
(PBS), N,N′-diisopropylcarbodiimide
(DIC), 1-hydroxybenzotriazole (HOBt), Anthraquinone-2-carboxylic acid
(AQCA),
tetraacrylate, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (DTPO),
agar (A1296 powder), tetrakis(dimethylamido) hafnium(IV), glucose
oxidase (GOX; G2133), N,N-diethylhydroxylamine
(DEHA), sodium l-lactate (LAC), and tetramethylammonium hydroxide
(TMAH). Dimethyl sulfoxide (DMSO), hydrogen peroxide (H2O2), and sulfuric acid were supplied by Biolab. N-Methyl-2-pyrrolidone (NMP), acetone, and 2-isopropanol
(IPA) were supplied by J.T Baker. LOR5A, SF15, PMMA A4, and MMA el6
were supplied by Microchem (now Kayaku Advanced Materials). Lactate
oxidase was from A.G Scientific. Hexamethyldisilazane (HMDS), AZ1505,
and AZ4562 were supplied by Microchemicals. (3-Aminopropyl)-dimethyl-ethoxysilane
was supplied by Gelest. SOI and Si wafers were supplied by SOITEC
and University Wafers (device layer 50 nm 10 Ω per cm, BOX 150
nm, handle 725 μm, 10 Ω per cm, both handle and device
layers were ⟨0-0-1⟩).
4
Fabrication of Pyrolyzed Photoresist Films
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The fabrication of PPFs consists of a thermal processing of a standard positive photoresist (AZ4562, supplied by Microchemicals), which was previously deposited by spin coating (6000 r.p.m. during 30 s) over a silicon wafer (Si (100)) and heated in an inert atmosphere (95 % Ar/ 5
A c c e p t e d M a n u s c r i p t % H 2 ) at rate of 10 °C/min up to a temperature of 1100 °C. For complete graphitization of the photoresist material, the annealing was performed during 1 h. 28 Finally, the PPFs with typical dimensions of 15 x 15 mm² were cleaned in an ultrasonic bath in acetone, methanol and 2propanol, then dried under Argon and stored at room temperature for later use. The resulting PPFs show electrochemical properties close to that observed in glassy carbon electrodes, and low resistivity.
A c c e p t e d M a n u s c r i p t % H 2 ) at rate of 10 °C/min up to a temperature of 1100 °C. For complete graphitization of the photoresist material, the annealing was performed during 1 h. 28 Finally, the PPFs with typical dimensions of 15 x 15 mm² were cleaned in an ultrasonic bath in acetone, methanol and 2propanol, then dried under Argon and stored at room temperature for later use. The resulting PPFs show electrochemical properties close to that observed in glassy carbon electrodes, and low resistivity.
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