The morphological characterization of the prepared Ag NC GDEs by SEM imaging experiments was performed before (for the as-prepared electrodes) and after electrochemical treatment. Analysis was conducted using a Zeiss Gemini 450 SEM equipped with an InLens secondary electron and a back-scattered electron detector. An accelerating voltage of 5 kV and a beam current of 200 pA were applied at a working distance of 4.5 mm. The AZtec 4.2 software (Oxford Instruments) was used to acquire EDX surface mappings of selected Ag NC GDEs. An acceleration voltage of 10 kV and a beam current of 1.2 nA were applied at a working distance of 8.5 mm.
Aztec 4
Manufactured by Oxford Instruments
The AZtec 4.2 software is a comprehensive analytical platform that enables advanced materials characterization and analysis. It provides a suite of tools for the acquisition, processing, and interpretation of data from a range of analytical techniques, including energy-dispersive X-ray spectroscopy (EDS) and electron backscatter diffraction (EBSD).
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Lab products found in correlation
Gemini 450 sem, by Zeiss (1 mentions)
Gemini 450, by Zeiss (1 mentions)
Vhx 600, by Keyence (1 mentions)
Gaia3, by TESCAN (1 mentions)
X max 150, by Oxford Instruments (1 mentions)
X max eds detector, by Oxford Instruments (1 mentions)
Smartsem, by Zeiss (1 mentions)
Crossbeam 540, by Zeiss (1 mentions)
4 protocols using aztec 4
1
Morphological Characterization of Ag NC GDEs
2
Morphological Analysis of Copper Samples
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The morphological
analysis of the Cu mesh, Cu foam, and Cu film samples was performed
with a Zeiss Gemini 450 instrument equipped with an InLens/secondary
electron and a backscattered electron detector. For the InLens and
backscattered electron detection modes, accelerating voltages (electron
currents) of 3.0 kV (100 pA) and 20 kV (1.5 nA) were used as standard
settings. AZtec 4.2 software (Oxford Instruments) was applied to acquire
energy-dispersive X-ray point spectra and the respective 2D elemental
mappings. Surface analysis of the blanket wafer coupons (reference
samples) was conducted by tapping mode AFM (Nanosurf Easy Scan II).
The surface characterization of the Cu foams deposited on a RDE was
further carried out using a 3D digital microscope with focus variation
(VHX600, Keyence).
analysis of the Cu mesh, Cu foam, and Cu film samples was performed
with a Zeiss Gemini 450 instrument equipped with an InLens/secondary
electron and a backscattered electron detector. For the InLens and
backscattered electron detection modes, accelerating voltages (electron
currents) of 3.0 kV (100 pA) and 20 kV (1.5 nA) were used as standard
settings. AZtec 4.2 software (Oxford Instruments) was applied to acquire
energy-dispersive X-ray point spectra and the respective 2D elemental
mappings. Surface analysis of the blanket wafer coupons (reference
samples) was conducted by tapping mode AFM (Nanosurf Easy Scan II).
The surface characterization of the Cu foams deposited on a RDE was
further carried out using a 3D digital microscope with focus variation
(VHX600, Keyence).
3
Shear Strength Analysis of Cu-Cu Bonds
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Shear strength testing is a common method used to determine the strength of a bond. In this study, the PTR-1100 shear tester from RHESCA Co., Ltd. (Tokyo, Japan) was used to measure the shear strength of the Cu-Cu bonds. This shear tester had a maximum load of 50 kgf and was operated at a speed of 20 µm/s. To hold the dies in place during testing, a special clamping tool with 500-µm-high holders was used. The shear strength was calculated as the maximum force required to break the bond divided by the bond area.
Fracture surface analysis is an important step in characterizing die-to-die bonding since it provides valuable information about the bonding quality; shear strength results often have high deviations.
The SEM images and EDX analysis of the fracture surface types were performed using GAIA3 (TESCAN) equipment. The detector X-Max 150 and the analysis software Aztec 4.2 (Oxford Instruments) were used for EDX analysis.
Fracture surface analysis is an important step in characterizing die-to-die bonding since it provides valuable information about the bonding quality; shear strength results often have high deviations.
The SEM images and EDX analysis of the fracture surface types were performed using GAIA3 (TESCAN) equipment. The detector X-Max 150 and the analysis software Aztec 4.2 (Oxford Instruments) were used for EDX analysis.
4
Structure of MoS2 Flakes on Si Substrates
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The chemical state and local structure of MoS2 flakes on Si substrates were examined using X-ray absorption fine structure (XAFS) measurements. XAFS spectra were collected at the PEEM/XAS end station at the Solaris National Synchrotron Radiation Centre in Cracow, Poland. XAS beam parameters involved a photon energy range of 300–1600 eV with a relative energy resolution (ΔE/E) not worse than 0.00 025, a beam size at the sample of 0.200 mm horizontally and 0.050 mm vertically and a photon flux at the sample of 109–1010 [ph/s/100 mA]. The sample was mounted on a standard nonmagnetic and conductive Elmitec PEEM sample holder for scanning electron microscopy (SEM)-EDS measurements.
The studies were performed with a scanning electron-ion microscope Crossbeam 540× (Zeiss) equipped with an EDS X-MAX detector (Oxford Instruments) with an active area of 80 mm2. An EDS spectrometer was calibrated for the Cu Kα line and controlled with a Smart SEM (ZEISS) and the Aztec 4.2 (Oxford Instruments) software. The surface morphology was imaged using an SESI and In-Lens detectors (mix signal) at an accelerating voltage of 5 kV, a working distance from the column WD = 5 mm and a stage tilt of 0°.
The studies were performed with a scanning electron-ion microscope Crossbeam 540× (Zeiss) equipped with an EDS X-MAX detector (Oxford Instruments) with an active area of 80 mm2. An EDS spectrometer was calibrated for the Cu Kα line and controlled with a Smart SEM (ZEISS) and the Aztec 4.2 (Oxford Instruments) software. The surface morphology was imaged using an SESI and In-Lens detectors (mix signal) at an accelerating voltage of 5 kV, a working distance from the column WD = 5 mm and a stage tilt of 0°.
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