SEM images were obtained using a Hitachi S-4200 microscope in a secondary electron image mode with accelerating voltages of 5–15 kV. The samples were dried and fractured in liquid nitrogen before SEM observations to obtain clean cut cross-sections. The flexural (bending) modulus of the samples was measured in a three-point bending mode using an Instron universal testing machine (model 5565).
S 4200 microscope
Manufactured by Hitachi
Sourced in Japan
The S-4200 is a scanning electron microscope (SEM) designed for high-resolution imaging of a wide range of samples. The S-4200 features a field emission gun (FEG) electron source, which provides high brightness and small probe size for enhanced resolution and image quality. The microscope is equipped with various detection systems, including secondary electron and backscattered electron detectors, allowing for the examination of surface topography and material composition. The S-4200 is suitable for a variety of applications, including materials science, nanotechnology, and life sciences research.
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Lab products found in correlation
2 protocols using s 4200 microscope
1
SEM and Mechanical Characterization
2
Microscopy and Diffraction Analysis of Materials
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Optical microscope observations were carried out with a BX-60 optical microscope (Olympus, Japan) . SEM and EDX observations were carried out with an S-4200 microscope (Hitachi, Japan) at accelerating voltages from 5 kV to 30 kV. Calibrations of X-ray signals were performed with standard Cu and Al films. XRD observations were carried using CuKα1 X-ray (1.54056˚A) with X-ray diffractometer of UR-TIMA-III (Rigaku, Japan) at a step size of 0.02 degree, a scan speed of 2 degree min -1 , and slit (light source and detector) of 1 degree.
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