Em ace200 sputter coater
The EM ACE200 Sputter Coater is a piece of laboratory equipment used for depositing thin, conductive coatings on samples. It is designed to prepare samples for examination in scanning electron microscopes (SEM) or other surface analysis techniques by improving their conductivity and contrast.
Lab products found in correlation
25 protocols using em ace200 sputter coater
Characterization of CS/PVA Hydrogels
Self-wicking Grids for Cryo-EM
Morphological Characterization of CS-AgNps
The morphology of films (surface and cross-sections) was observed by SEM through a Verios G4 UC Scanning Electron Microscope (Thermo Scientific, Bruno, Czech Republic) equipped with an energy dispersive X-ray spectrometer (EDS, EDAX Octane Elect Super SDD detector, Ametek, Mahwah, NJ, USA). The samples were coated with 10 nm platinum using a Leica EM ACE200 Sputter coater to provide electrical conductivity and to prevent charge buildup during exposure to the electron beam.
The visualization of the surface films (unloaded and IBF-loaded F #3 sample) was carried out by atomic force microscopy (AFM) using Nanoscope IIIa-type Multimode (Digital Instruments, Tonawanda, NY, USA) equipped with an “E”-type scanner. Amplitude- and height-mode images were captured at room temperature in the air using the tapping mode with a silicon tip cantilever (Bruker Corporation, Billerica, MA, USA) operated at a resonance frequency of 275–300 kHz and at a scan rate of 1.2 Hz. The images were evaluated with the Nanoscope V614r1 software (Digital Instruments, Buffalo, NY, USA).
Temperature-Dependent Resistivity of MXene Pellets
a Quantum Design
Physical Property Measurement System (PPMS), temperature-dependent
resistivity measurements were conducted over a temperature range of
4 to 300 K. For these measurements, we utilized MXene pellets that
were prepared using a standard laboratory press at room temperature
with a pressure of 20 MPa. These pellets were cut into rectangular
stripes for the measurement. On each pellet, four gold (Au) electrode
pads, each measuring between 50 and 100 nm in thickness and 0.1 mm
in width, were deposited with a Leica EM ACE200 sputter coater. These
pads were 2.5 mm apart. Indium wires were subsequently attached to
the Au pads, creating a 4-probe geometry. To ensure optimal electrical
contact, a small amount of silver (Ag) paint was additionally applied
at the contact points. The resistivity measurements at room temperature
were carried out using a four-point probe instrument (Ossila). MXene
pellets for these measurements were 0.25 mm-thick and 6 mm in diameter
and made using a standard laboratory press at 20 MPa.
Scanning Electron Microscopy Analysis of Electrospun Fibers
Scanning Electron Microscopy of 3D Bone Scaffolds
Analyzing Surface Morphology of Cu-SNAP Composite Films
Scanning Electron Microscopy Analysis of Synthesized Samples
Characterization of TSPCU Films
Crystalline Structure Characterization of Membranes
structure of the membranes was studied by X-ray diffraction (XRD)
by a PANalytical X’Pert Pro MPD machine operating with Cu Kα
(λ = 1.5405 Å) radiation. The X-ray scanning was performed
over a 2θ range of 10–80°, with a step size of 0.0167°.
Scanning electron microscopy (SEM) studies were performed in a
FEI Nova NanoSEM 230 that operated in the 10–15 kV range, after
the samples were attached to a conductive carbon tape and sputtered
by Leica EM ACE 200 sputter coater with a 5 nm thick platinum layer.
The specific surface area of the samples was determined by single-point
BET measurements (Coulter SA3100) carried out at 77 K. The samples
were pretreated at 300 °C for 15 min in helium flow (50 cm3/min).
Inductively coupled plasma mass spectrometry
(ICP-MS) measurements
were performed in an Agilent 7500 ce ICP-MS device to determine the
amount of Cu dissolved during filtration.
ζ Potential
values were defined by using laser Doppler electrophoresis
(DLS, Zetasizer Nano S, Malvern Instruments) and solid surface ζ
potentiometry (Anton-Paar SurPASS Electrokinetic Analyzer).
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