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Su 8 2002 negative photoresist

Manufactured by MicroChem
Sourced in United States

SU-8 2002 is a negative photoresist designed for microfabrication applications. It is a high-contrast, epoxy-based photoresist that can be used to create high-aspect-ratio structures. The core function of SU-8 2002 is to serve as a photosensitive material that can be patterned using standard photolithographic techniques.

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2 protocols using su 8 2002 negative photoresist

1

Microcontact Printing using PDMS Stamps

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PDMS stamps for microcontact printing were prepared as previously described.23 (link) A photolithographic mask was designed in AutoCAD (Autodesk Inc.) and ordered from Output City (Brandon, OR, USA). Each mask consists of an array of bihexagonal islands with a single shared edge, each shape having a total area of 5000 μm2 (hexagon edge length, 31 μm). This mask was imposed on top of a silicon wafer (Wafer World, FL, USA) spin-coated with SU-8 2002 negative photoresist (MicroChem Corp., MA, USA), which was then exposed to UV light to crosslink the pattern. Uncrosslinked regions were dissolved by submerging the wafers in propylene glycol methyl ether acetate, followed by isopropyl alcohol, and then dried. PDMS (Sylgard 184, Dow Corning, MI, USA) was poured over the wafer and then degassed in a vacuum desiccator. After curing, the patterned PDMS was peeled off the surface and cut to be used as stamps (ESI Fig. S25).
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2

Fabrication of Microfluidic Stamps via Photolithography

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Standard photolithography and soft lithography protocols were used to make wafers and PDMS stamps52 (link). Briefly, wafer templates were fabricated by spin-coating SU-8 2002 negative photoresist (MicroChem) onto silicon wafers and exposing the coated wafer to UV light through a custom photomask using a mask aligner. The photomask consisted of either 15 μm wide lines separated by 2 μm wide gaps (15 × 2) or 10 μm wide lines separated by 10 μm wide gaps (10 × 10). Wafers were then immersed in developer solution to remove un-exposed photoresist and coated with trichloro (1H,1H,2H,2H-perfluorooctyl) silane. PDMS was created by mixing the elastomer base and curing agent of Sylgard 184 silicone elastomer kit (Dow Corning) in a 10:1 mass ratio. PDMS was then poured over a wafer template in a Petri dish, de-gassed, and cured at 65 °C for at least four hours. Cured PDMS was then carefully removed from the wafer and cut into square stamps measuring approximately 2 cm × 2 cm.
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