In this typical experiment, the BP nanoflakes with different thicknesses (specifically 28 nm, 47 nm, and 302 nm) were obtained by repeatedly exfoliating bulk crystals using Scotch tape. An all-dry transfer technique [9 (link)] was used for transferring BP flakes onto a heavily doped p-type silicon substrate with 300-nm thick silicon dioxide. All substrates were cleaned in acetone for about 10 min, followed by O2 plasma cleaning before transferring (Figure 1 a). In the all-dry transfer process (Figure 1 b), polydimethylsiloxane (PDMS) was used as a viscoelastic stamp. To obtain the large-area BP nanoflakes, both BP nanosheets adhered with PDMS were baked on the hotplate for about 2 min at a temperature of 100 °C before exfoliating. Then the BP nanoflakes were mechanically transferred onto the PDMS. After that, under a Keyence Digital Optical Microscope and a micromanipulator, the BP nanoflakes were transferred onto the silicon substrate by peeling off the PDMS. Besides, prior to device fabrication, all samples were soaked in acetone for about 1 h to remove contamination (Figure 1 c).
Digital optical microscope
Manufactured by Keyence
Sourced in Japan
The Digital Optical Microscope is a device used for magnifying and viewing small objects or samples. It employs digital imaging technology to capture and display high-resolution images of the observed specimens.
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4 protocols using digital optical microscope
1
Fabrication of Black Phosphorus Nanoflakes
2
Evaluating Microbial Growth on Surfaces
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The printed biofilms on Petri dishes (mm2) were evaluated by using ImageJ program. A digital optical microscope from Keyence (Osaka, Japan) with a long working distance zoom objective was used to display the grown microbial culture on the wood and sandstone surfaces.
3
Microstructural Analysis of Oxidized Powders
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The oxidized powders, sintered substrates, and tribological wear tracks on the sintered substrates were analyzed for their microstructural morphology.
Optical microscopy has been carried out by Keyence digital-optical microscope, (Keyence VHX-950F model, Osaka, Japan). Scanning Electron Microscopy has been carried out by using Thermo Scientific Scios 2 equipment (Waltham, MA, USA) under SEM-BSD and SEM-SE modes using 4kV accelerating voltage. Phase analysis and elemental identification was performed by XRD—Cu Kα radiation using a Bruker AXS D8 Discover diffractometer (Billerica, MA, USA) equipped with Göbel-mirror and a scintillation detector.
Optical microscopy has been carried out by Keyence digital-optical microscope, (Keyence VHX-950F model, Osaka, Japan). Scanning Electron Microscopy has been carried out by using Thermo Scientific Scios 2 equipment (Waltham, MA, USA) under SEM-BSD and SEM-SE modes using 4kV accelerating voltage. Phase analysis and elemental identification was performed by XRD—Cu Kα radiation using a Bruker AXS D8 Discover diffractometer (Billerica, MA, USA) equipped with Göbel-mirror and a scintillation detector.
4
Quantifying Modular Implant Taper Damage
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