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Glow discharged thick carbon film 400 mesh copper grid

Glow-discharged thick carbon film 400 mesh copper grid is a type of lab equipment used in electron microscopy. It provides a sturdy support for samples during imaging and analysis.

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2 protocols using glow discharged thick carbon film 400 mesh copper grid

1

Characterization of Protein Assemblies

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Assemblies were characterized in solution by dynamic light scattering (DLS). Samples were measured using an UNcle (UNchained Labs) according to the manufacturer’s directions. Briefly, 8.8 μL of sample was loaded in triplicate into the capillary cassette. For each replicate, 10 acquisitions 10 seconds in length were collected. Assemblies were further characterized by negative-stain electron microscopy. Samples were diluted to between 0.1 and 0.5 mg/mL total protein depending on the assembly stoichiometry, applied to a glow-discharged thick carbon film 400 mesh copper grid (Electron Microscopy Sciences), and stained with 2% uranyl formate. Care was taken to ensure the stain thickness was sufficient to support the larger assemblies. Micrographs were collected on a Talos L120C (FEI) at up to 48,000× magnification. Individual micrographs were processed with ImageJ.
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2

Characterization of Protein Assemblies

Check if the same lab product or an alternative is used in the 5 most similar protocols
Assemblies were characterized in solution by dynamic light scattering (DLS). Samples were measured using an UNcle (UNchained Labs) according to the manufacturer’s directions. Briefly, 8.8 μL of sample was loaded in triplicate into the capillary cassette. For each replicate, 10 acquisitions 10 seconds in length were collected. Assemblies were further characterized by negative-stain electron microscopy. Samples were diluted to between 0.1 and 0.5 mg/mL total protein depending on the assembly stoichiometry, applied to a glow-discharged thick carbon film 400 mesh copper grid (Electron Microscopy Sciences), and stained with 2% uranyl formate. Care was taken to ensure the stain thickness was sufficient to support the larger assemblies. Micrographs were collected on a Talos L120C (FEI) at up to 48,000× magnification. Individual micrographs were processed with ImageJ.
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