The thermal behavior of MC, resin, physical mixture of MC and resin (2:1), and MR was determined with the aid of a DSC Analyzer (Shimadzu, TA-60WS, Japan). The temperature was increased to 250 °C at the rate of 15 °C min -1 .
The XRD patterns of MC, resin, MR, and physical mixture of MC and resin (2:1) were analyzed with an X-ray diffractometer (D/MAX-3C, Riguku Co., Japan) at a 56 kV voltage and 35 mA current. Samples were finely ground and irradiated with monochromatized Cu-Ka radiation after passing through Nickel filters and analyzed between 2 and 40° (2θ).
Morphologies of MC, resin, MR, and physical mixture of MC and resin were investigated by SEM. Dried samples were attached to specimen stubs with a double-sided copper tape and sputter coated with gold-palladium in the presence of argon gas using a Hummer sputter coater (Anatech Ltd., Denver, NC). The samples were recorded with a JEOL JSM-840 scanning electron microscope (JEOL USA Inc., Peabody, MA) at a 5 kV accelerating voltage and a probe current of 3 × 10 -11 A.
The XRD patterns of MC, resin, MR, and physical mixture of MC and resin (2:1) were analyzed with an X-ray diffractometer (D/MAX-3C, Riguku Co., Japan) at a 56 kV voltage and 35 mA current. Samples were finely ground and irradiated with monochromatized Cu-Ka radiation after passing through Nickel filters and analyzed between 2 and 40° (2θ).
Morphologies of MC, resin, MR, and physical mixture of MC and resin were investigated by SEM. Dried samples were attached to specimen stubs with a double-sided copper tape and sputter coated with gold-palladium in the presence of argon gas using a Hummer sputter coater (Anatech Ltd., Denver, NC). The samples were recorded with a JEOL JSM-840 scanning electron microscope (JEOL USA Inc., Peabody, MA) at a 5 kV accelerating voltage and a probe current of 3 × 10 -11 A.