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Pt7150 plasma barrel etcher

Manufactured by Quorum Technologies

The PT7150 plasma barrel etcher is a vacuum-based surface treatment system designed for etching and cleaning various materials. It utilizes a plasma-enhanced chemical etching process to remove material from the surface of substrates. The PT7150 is capable of processing a range of sample sizes and configurations.

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2 protocols using pt7150 plasma barrel etcher

1

Particle Morphology of DPA-MPC-DPA Copolymer Nanoparticles

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Particle morphology of 0.15 and 1.5 % w/v DPA 50 -MPC 250 -DPA 50 copolymer nanoparticle systems was investigated at pH 7.5, via STEM, using a Zeiss SIGMA field emission gun scanning electron microscope (FEG-SEM) equipped with a Zeiss STEM detector. Working conditions used were; 20 kV accelerating voltage, 20 µm aperture, and 3 mm working distance. To prepare the STEM samples, 200 mesh Formvar coated copper TEM grids were plasma treated (5 watts) in a Polaron PT7150 plasma barrel etcher for 30 seconds, to improve surface wettability, 1 drop of sample applied to the TEM grid for 60 seconds, excess wicked way, 1 drop of filtered (0.22 µm) 2 % w/v PTA (pH 7.5) applied to the TEM grid for 60 seconds, excess wicked away, and then air dried.
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2

Particle Morphology Analysis via STEM

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Particle morphology was investigated via STEM, using a Zeiss SIGMA field emission gun scanning electron microscope (FEG-SEM) equipped with a Zeiss STEM detector. Working conditions used were; 20 kV accelerating voltage, 20 µm aperture, and 3 mm working distance. To prepare the STEM samples, 200 mesh Formvar coated copper TEM grids were plasma treated, 40 seconds at 5 watts, in a Polaron PT7150 plasma barrel etcher for 30 seconds, to improve surface wettability. Then 1 drop of sample (0.22 µm filtered) was applied to the TEM grid for 60 seconds, excess wicked way, 1 drop of filtered (0.22 µm) 2% phophotungstic acid (PTA) (pH 7.4) applied to the TEM grid for 60 seconds, excess wicked away, and then air dried at room temperature.
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