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Ltspice

Manufactured by Analog Devices
Sourced in United States

LTspice is a free, high-performance SPICE simulation software developed by Analog Devices. It is designed for the simulation and analysis of analog and mixed-signal circuits.

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8 protocols using ltspice

1

Determining Transducer Equivalent Circuit

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We determined the equivalent circuit model parameters in Fig. 3d in the following procedure. We firstly measured the frequency response of the system by monitoring the voltage across the external resistor Re=463Ω connected in series with the transducer. We fixed the shutter so that the cavity was either opened or closed and measured the voltage amplitude across the resistor Re while sweeping the frequency. Subsequently, we used a circuit simulator (LTspice, Analog Devices) to reproduce the experimental frequency response numerically. We initially determined the parameters Cd,C0,L0, and R0 based on a least squares method using the experimental result when the cavity was opened. Then, using those parameters, we determined the other parameters Cc,Lc, and Rc from the experimental result when the cavity was closed. The determined parameters are listed in Table 2.
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2

Comparative Analysis of PWM-VLC and PDM-VLC

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To compare the experimental results of the PWM-VLC with those of the PDM-VLC, we calculated the theoretical results using the LTspice (LTspice, Analog Devices, Inc., U.S.A.).
When the frequency of waves was 8.728 Hz, we simulated the input and output signals on the lowpass filter as a digital-to-analog conversion component.
Furthermore, when the frequency of the sine wave was 8.728 Hz in both the PWM-VLC and the PDM-VLC, we obtained the DMD switching frequency dependence of the total harmonic distortion (THD), which was calculated by the fundamental wave and five higher harmonic waves using MATLAB (MATLAB R2019b, The MathWorks, U.S.A.).
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3

Modeling Neuron-Device Magnetic Interactions

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Biocytin-injected neuron morphology (Fig. 1a) was traced to create a vector representation, which was imported into COMSOL multiphysics simulation environment (COMSOL Inc., Stockholm, Sweden). Geometry was extruded to a height of 1.1 μm (Fig. 1c). The membrane was modeled with exterior surface area 1450 μm2, volume 14.39 μm3, relative permeability ε=1, relative permittivity μ=1, electrical conductivity σ=1e-13 S/m, surrounding the intracellular environment, surface area 1431.1 μm2, volume 463.77 μm3, which was modeled using the electrical properties of cerebrospinal fluid, ε = 1.09e2, μ = 1, σ = 2 S/m. Representative action potential data was extracted from voltage traces of current clamp recordings (Fig. 3a, sampling frequency = 6103.5 Hz, total recording time 23:51.768) and used as input for an electronic circuit simulation software (LTSPICE, Analog Devices, Norwood, MA). The cell-device interface was simulated as a 100 MΩ resistor in parallel with a 15 pF capacitor. The current was measured across this interface and downsampled to 20 key values, which were applied as inputs in COMSOL on one face of the neuron in a parametric sweep stationary study for simulations of magnetic flux density and field strength during action potentials to compare the response of the naïve model neuron to that of the modelled cell-device interface (Fig. 3c).
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4

Fabrication of Wireless Sweat VIA Sensor

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A flexible copper-clad laminate (DSflex-600 122512E, DOOSAN) composed of a thin film of copper/PI/copper (thickness of 12 μm each) that served as the substrate of the FPCB, electroplated copper with a thickness of 10 μm, and a cover layer (12.5-μm-thick PI and 15-μm-thick adhesive, MAH-0X-25NX, INNOX) were used to fabricate the wireless sensor system. The exposed top and bottom copper layers were plated with electroless nickel immersion gold (thickness of 3.5 μm Ni, 0.03 μm Au) to form soldering pads for component mounting. Soldering paste (LF999, KELLYSHUN) and wire (XL806, Alpha Assembly Solutions) were used to mount the necessary components onto the FPCB, including the BLE microcontroller (nRF52832, Nordic Semiconductor), amplifier (LTC2066 and LTC6081, Analog Devices), clock generator (LTC6900, Analog Devices), linear regulator (AP2112K, Diodes Incorporated), and various passive elements. The calibration curve of the admittance from the sweat VIA sensor versus the wireless readout ADC data of the sensing circuit was obtained using reference data obtained through a circuit simulation (LTspice, Analog Devices) and measurement of the output voltage of the sensing circuit at a fixed admittance of the sweat VIA sensor.
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5

Memristive Cell Model in LTspice

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A memristive cell model consisting of two
back-to-back Schottky barriers in series with a nonlinear resistance
(channel a) in combination with a parallel conducting channel exhibiting
memristive properties (channel b) was implemented in LTspice (circuit
simulator from Analog Devices). The script used for modeling is reported
in Supporting Information, Figure S7 and
contains five parts: parameter definition, memory state equation,
current–voltage characteristic for the memristive device, current–voltage
characteristic for the nanowire, and auxiliary functions. The memristive
behavior is based on an adaptation of the memdiode model for resistive
switching devices reported in ref (70 (link)). The model includes the snapback effect and
an internal series resistance. A schematic representation of the circuit
used for modeling is reported in Supporting Information, Figure S8.
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6

Circuit Simulation and Analysis Workflow

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All circuit simulations in this study were executed using LTspice, offered by Analog Devices (2008) . The simulator is based on the open-sourced SPICE framework (Nagel and Pederson, 1973 ), which utilizes the numerical Newton–Raphson method to analyze non-linear systems (Nichols et al., 1994 (link)). Signal analysis was performed using the Python scripts we developed. Curve and surface fittings were performed using MATLAB’s curve fitting toolbox. Simulation files are available upon request.
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7

Inkjet-Printed Electrochromic Circuit

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The circuit was simulated with LTSpice (Analog Devices, Norwood, MA, USA), designed with Kicad (Canonical Ltd, London, UK) and printed with the inkjet printer CeraPrinter X-Serie (Ceradrop, Parc d’Ester Technopole, Limoges, France). The ink used for the inkjet printing was a silver ink from DuPont PE-410 (DuPont, Wilmington, DE, USA), which was cured at 130 °C for 20 min. The discrete components and electrochromic displays were attached to the printed circuit with a silver epoxy EPO-TEK H20E (Agar Scientific Ltd, Essex, UK) by curing it at 80 °C for 3 h.
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8

Multi-Simulator Analysis of Wireless Biomedical Sensor

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The SPICE simulation of the reflection response of the equivalent circuit at different frequencies was performed using the analog electronic circuit simulator (LTspice, Analog Devices). Small signal (linear AC) analysis determined S11 and resonance frequency.
A commercial electromagnetic simulator (Feko, Altair) performed the near-field simulation. The simulation captured the inductive coupling behavior between the LC tank (with a three-turn coil; diameter, 10 mm) and the readout coil. Key parameters used were as follows: A 20-pF capacitor was connected to the three-turn coil to form the LC circuit. The single-turn readout coil (diameter, 10 mm) was stimulated with an incident AC voltage source (1 V; 50 to 200 MHz). The distance of the gap between the LC tank and readout coil was set to fixed values (3 to 13 mm).
A commercial finite element analysis simulator (COMSOL Multiphysics) performed the simulation to estimate the SAR and heat transfer of the system with a tissue model. The simulation studied how a tissue absorbs RF energy radiated from a single-turn coil antenna (diameter, 10 mm) with an incident AC power source (−9 dBm, 100 MHz). The simulation defined the antenna as a perfect electrical conductor. The distance between the antenna and tissue surface was 0.5 mm.
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