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Titan themis microscope

Manufactured by Thermo Fisher Scientific
Sourced in United States

The Titan Themis is a high-performance transmission electron microscope (TEM) designed for advanced materials research and characterization. It offers exceptional resolution, high-speed imaging, and advanced analytical capabilities. The Titan Themis is a versatile instrument that can be configured to meet the specific needs of various research applications.

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12 protocols using titan themis microscope

1

Multi-Modal Structural Characterization Protocol

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TEM and HAADF-STEM
images as well as wide-angle electron diffraction (ED) patterns were
collected using a JEOL JEM2200FS microscope operating at 200 kV accelerating
voltage. High-resolution HAADF-STEM and HAADF-STEM images at different
tilt angles were recorded using an FEI Titan Themis microscope operated
at 300 kV with the aid of a motorized dual-axis tomography holder.
TEM and ED images were compared with those simulated in Crystal Maker
10.4.5 and Single Crystal 3.1.5 software (purchased from CrystalMaker
Software). SEM images were obtained on a FEI Helios 660 operated at
3 kV using immersion mode.
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2

Microstructure Characterization of Deformed Pillars

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The orientations and deformed morphologies were characterized by X-ray diffraction (XRD; GE Seifert 2-circle diffractometer) and scanning electron microscopy (SEM; FEI Helios Nanolab 600i). TEM and STEM were used to characterize the deformation compatibility of the pillars. TEM images, including diffraction contrast bright field and dark field images, were taken on a Philips CM20 microscope operated at 200 kV. STEM micrographs were obtained on a FEI Titan Themis microscope operated at 300 kV, using an aberration-corrected probe with ~0.1 nA current and a convergence semi-angle of 24 mrad, and the high-angle annular dark field (HAADF) detector with collection semi-angles of 73~352 mrad. We also collected the energy dispersive X-ray spectroscopy (EDS) spectra by a windowless, four quadrant silicon-drift-detectors covering a solid angle of 0.7 sr.
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3

Characterization of Nanostructured Materials

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TEM images were obtained using a JEOL JEM-2200FS microscope operating at 200 kV. Carbon-coated TEM grids from Ted-Pella were used as substrates. For element mapping using HAADF-STEM combined with EDX, a beam current of 6 nA (no difference when measured with 1 or 3 nA) and detection with a SuperEDX system (4 detectors) were used. The measurements were performed on an FEI Titan Themis microscope operated at 300 kV with a probe semiconvergence angle of 18 mrad (beam current 70 pA). EDX spectroscopy maps were collected on an FEI Talos F200X microscope operated at 200 kV. SEM images were measured using a Hitachi 3030Plus tabletop electron microscope. Powder XRD was measured on a STOE STADI P diffractometer (Cu-Kα1 irradiation, λ = 1.540598 Å). XPS measurements were carried out in normal emission using a monochromatized Al Kα X-ray radiation source and a Scienta R3000 display analyzer. For the quantification of the near-surface composition, core levels of S2s, Cu2p and Mg2s were fitted with Voigt-Lorenthian curves using XPSmania (implemented in Igor Pro) which was kindly provided by the ALOISA beamline staff of the ELETTRA synchrotron facility. The energy dependency of the mean free path was included in the photoionization cross sections54 (link) resulting in the following values (see Table S1).
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4

Comprehensive Structural Characterization of Self-Assembled Superlattices

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TEM and HAADF-STEM
images as well as ED and small-angle ED patterns were collected with
the use of JEOL JEM2200FS microscope operating at 200 kV accelerating
voltage. EDX-STEM maps and HAADF-STEM images at different tilt angles
were recorded using an FEI Titan Themis microscope operated at 300
kV equipped with a SuperEDX detector, with the aid of a motorized
dual-axis tomography holder. Captured TEM and electron diffraction
images were compared with the ones simulated in Crystal Maker 10.4.5
and Single Crystal 3.1.5 software, purchased from CrystalMaker Software
Ltd. Electron tomography was carried out in HAADF-STEM mode at 300
kV using a small beam semiconvergence angle of 2.5 mrad, to increase
the depth of field. Images were recorded over a tilt angle range ±
(57–72)° and interval 2–3°. Reconstruction
was done using IMOD with a Back Projection algorithm and SIRT-like
radial filter.81 (link) The tomograms were recorded
on SLs self-assembled on carbon-coated TEM grids as continuous films
or via a microemulsion technique. SEM images were obtained on a FEI
Helios 660 operated at 3–7 kV using immersion mode.
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5

Microstructural Characterization of Materials

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X-ray diffraction (XRD; GE Seifert 2-circle diffractometer), scanning electron microscope (SEM; FEI Helios Nanolab 600i), and transmission electron microscope (TEM) were used to characterize the microstructures and deformations. Diffraction contrast bright field and dark field images were taken on a CM20 microscope operated at 200 kV. Scanning TEM (STEM) micrographs were taken on a FEI Titan Themis microscope operated at 300 kV, using an aberration-corrected probe with ~0.1 nA current and a convergence semi-angle of 24 mrad, and the high-angle annular dark field (HAADF) detector with collection semi-angles of 73~352 mrad. Energy dispersive X-ray spectroscopy (EDS) spectrum imaging was collected using a windowless, four quadrant silicon-drift-detectors covering a solid angle of 0.7 sr.
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6

STEM Microstructure Analysis of Samples

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The microstructure of a few selected samples was studied by scanning transmission electron microscopy (STEM). These experiments were carried out by an aberration-corrected Titan-Themis microscope (manufacturer: FEI, Hillsboro, OR, USA) at 200 keV. For EDS characterization, a Super-X detector was used. The TEM samples were prepared by focused ion beam (FIB) milling.
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7

Multiscale Electron Microscopy Analysis

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Transmission electron
microscopy (TEM) and high-angle annular dark-field scanning TEM (HAADF-STEM)
images as well as wide- and small-angle electron diffraction (ED)
patterns were collected with the use of JEOL JEM2200FS microscope
operating at a 200 kV accelerating voltage. Energy-dispersive X-ray
(EDX-STEM) maps and HAADF-STEM were recorded using an FEI Titan Themis
microscope operated at 300 kV. SEM images were obtained on a FEI Helios
660 operated at 3 kV using immersion mode.
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8

Differential Phase-Contrast Imaging Technique

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The differential phase-contrast images were acquired using a four segmented annular detector (DF4), coupled to a double-corrected FEI Titan-Themis microscope operated at 200kV. Images from individual segments were acquired with a pixel dwell time set at 4 µs using a 228 mm camera length, resulting in acceptance angles between 9 -51 mrad, while when collecting simultaneously the signal from DF4 and annular dark field (ADF), the acceptance angles were limited to 9-36 mrad and 36 -176, respectively. The DPC technique was used to image the in-plane displacement of the transmitted electrons, and the images proportional to the projected potential, 1 the projected electric field 3 4 and the projected charge distribution 5 were calculated according to the references.
The images presented in the manuscript were acquired using an experimental electron dose about 10 5 e Å 2 . Additionally, lower dose experiments were performed at doses of about 10 3 e Å 2 .
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9

Transfer and Characterization of MoS2 Films

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The sapphire substrate
with as-grown material
was spin-coated with PMMA and baked at 85 °C for 10 min.
The MoS2/PMMA film was detached from the sapphire substrate
by submerging it in water. Water surface tension promotes the separation
of the grown material from the substrate. Next, the film floating
in water is collected using a TEM grid and heated for 15 min at 85
°C. After the transfer is completed, the TEM grid is left in
acetone overnight and annealed at 250 °C.
For aberration-corrected
scanning transmission electron microscopy (STEM) imaging, an FEI Titan
Themis microscope equipped with double Cs corrector, monochromator,
and Schottky X-field emission gun was operated at an acceleration
voltage of 80 kV. The electron probe current was in the 17–20
pA range. The semiconvergence angle of the probe was 21.2 mrad. High-angle
annular dark field detector (HAADF) was used to capture the images
using short dwell times (8 μs) with 512 × 512 pixels. The
camera length was set to 185 mm which corresponds to the 49–200
mrad collection angle range. Focused ion beam (FIB, Zeiss Nvision40)
was used to prepare the cross-section lamella from the device. For
the low-resolution cross-sectional TEM imaging, a FEI Talos F200 S
G2 microscope was used at 80 kV acceleration voltage.
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10

Characterization of Hb@AuNCs by DLS, Zeta, and STEM

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The hydrodynamic size of the Hb@AuNCs was evaluated by dynamic light scattering (DLS) (Zetasizer Nanoseries nano-ZS, Malvern, UK). The zeta (ζ)-potentials were assessed also using the Zetasizer. The morphology of the Hb@AuNCs was evaluated by scanning transmission electron microscopy (STEM), using a Titan Themis microscope (Thermo Fisher Scientific) operating at 200 kV with a probe of 20 mrad convergence angle and 50 pA current. The microscope was equipped with a high-brightness Schottky emitter (X-FEG), a probe aberration correction system (CEOS DCOR) and a Super-X energy dispersive X-ray (EDX) detector. Annular dark-field (ADF) STEM images were acquired with a collection angle of 31–192 mrad and EDX spectrum images were acquired with a probe current of 250 pA. Colored elemental maps were processed using Velox software, after removal of the background in the spectra (net count maps). The Cliff-Lorimer method were applied for EDX quantification, using the Brown-Powell ionization cross-sections. The samples were prepared by powder dispersion on lacey carbon films supported by copper meshed TEM grids (LC200-Cu, Electron Microscopy Sciences, PA, US).
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