at 10–5 mbar in a homebuilt reactor, with specifications
discussed in a previous publication.13 (link),14 (link) The metal–organic
precursor used for the deposition of the SnO2 films is
tetrakis(dimethylamido)-Sn(IV), TDMA-Sn, 99.9%, from STREM Chemicals,
which is kept at 50 °C. As a co-reactant, water is used. Both
the precursor and co-reactant are supplied to the ALD chamber in a
vapor-drawn mode. The ALD cycle, carried out at 100 °C, consists
of a 500 ms TDMA-Sn dose, followed by a purge step of 15 s, then an
H2O vapor dose of 25 ms, followed by a purge step of 15
s. The selected dosing and purge times correspond to self-limiting
conditions for the ALD process. The thickness, and refractive index,
of the ALD SnO2 layers, grown on the c-Si substrate, is
determined by means of spectroscopic ellipsometry (SE) using a Cauchy
model in the region between 1.2 and 2.7 eV. The SE used is a J.A.
Woollam, Inc. M2000 UV ellipsometer, and the measured growth per cycle
is 0.11 (±0.01) nm.