SEM micrographs for free and encapsulated AgNP were obtained using a Hitachi SU-6600 field emission SEM (Hitachi, Maidenhead, UK) at an accelerating voltage of 25 kV and working distance of 8 mm. For SEM analysis, a 5 µL drop-cast of each sample was made onto a 5 × 5 mm pure silicon wafer substrate (Ted Pella Inc., Redding California, USA) 24 h prior to obtaining the micrographs and allowed to air dry. For STEM analysis, 3 µL of each sample was dropcast onto a carbon formvar copper grid (Agar Scientific Ltd., Stanstead, UK) 24 h prior obtaining and allowed to air dry.
5 mm pure silicon wafer substrate
Manufactured by Ted Pella
Sourced in United States
The 5 × 5 mm pure silicon wafer substrate is a fundamental component used in various electronic and semiconductor applications. It serves as a foundation for the fabrication of integrated circuits, sensors, and other microelectronic devices. The wafer is made of high-purity silicon, ensuring consistent and reliable performance.
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Lab products found in correlation
2 protocols using 5 mm pure silicon wafer substrate
1
Visualizing Silver Nanoparticles via SEM and STEM
2
Characterization of Silver Nanoparticles by SEM
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SEM micrographs for free and encapsulated AgNP were obtained using a Hitachi SU-6600 field emission SEM (Hitachi, Maidenhead, UK) at an accelerating voltage of 25 kV and working distance of 8 mm. For SEM analysis, a 5 μL drop-cast of each sample was made onto a 5 × 5 mm pure silicon wafer substrate (Ted Pella Inc., Redding California, USA) 24 h prior to obtaining the micrographs and allowed to air dry. For STEM analysis, 3 μL of each sample was drop-cast onto a carbon formvar copper grid (Agar Scientific Ltd., Stanstead, UK) 24 h prior obtaining and allowed to air dry.
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