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108 manual sputter coater

Manufactured by Ted Pella
Sourced in United States

The 108 Manual Sputter Coater is a laboratory equipment designed to apply thin, conductive coatings to samples for various analytical techniques. It operates by sputtering target materials onto the sample surface in a controlled vacuum environment. The coatings produced can enhance sample conductivity, improve image quality, and protect sensitive samples.

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5 protocols using 108 manual sputter coater

1

Visualizing Brown Rice-Fish Cereal

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Scanning Electron Microscopy (SEM) was used to visualize the morphological features of drum‐dried brown rice‐fish instant cereal. Samples, affixed to carbon taped stubs, were coated with gold in a vacuum evaporator (108 Manual Sputter Coater, Ted Pella Inc. USA). Electron micrographs of the gold‐coated samples were acquired using a Phenom Desktop SEM (Phenom‐World, The Netherlands) at an acceleration voltage of 15 kV.
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2

Visualizing Seed Surface Morphology

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Whole mount of mature dry seeds from WT Col-0 and the gosamt1-1gosamt1-2 mutant line were attached to double-sided carbon sealing tape and coated with gold in a 108 manual sputter coater (Ted Pella Inc.). Morphological details of the seeds surface were photographed using a scanning electron microscope (Hitachi TM3000 Tabletop SEM) set to 15 kV. A minimum of three biological replicates were used for each genotype.
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3

Fabrication of Superhydrophobic Surfaces

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Silicon substrates were rinsed with fresh water and allowed to thoroughly dry. A tinned-copper wire of diameter, a = 150 µm was placed on flat silicon substrates. The samples were then treated with a commercial spray (Rust-Oleum® NeverWet® Liquid Repelling Treatment), which deposited an anti-wetting solution. The sprayed samples were placed under a fume hood at lab temperature (~22 °C) for 5 hours to dry. After the solvent of the spray (acetone) evaporated, microparticles coated both the substrate and the wire, resulting in a macrotextured liquid-repelling surface. A FEI QUANTA 3D FEG SEM was used for obtaining the images of the coated silicon substrates. The samples were coated with 10 nm of gold (Ted Pella 108 Manual Sputter Coater) and then images were obtained using a 2-kV acceleration voltage.
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4

Characterization of Fibrous Nonwoven Mats

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Morphology,
specifically fiber diameter, diameter distribution, pore size, and
porosity were observed using a Phenom ProX SEM (Phenom-World, The
Netherlands) with a 10 kV acceleration voltage. Prior to imaging,
samples were gold sputter-coated for 5 s using a 108 manual sputter
coater (TED PELLA, Inc). The presence of beads, fiber diameter, and
diameter distribution was observed at 600× and 2000× magnification,
respectively, while the pore size analysis was conducted at 25 000×
magnification. Further analysis was conducted using DiameterJ, a plugin
of ImageJ software (National Institutes of Health), where a minimum
of two images were taken from random locations and used to calculate
both fiber and pore size distributions. Traditional, statistical region
merging and mixed segmentation were used to produce the most accurately
segmented image.
Tensile strength and Young’s modulus
of fibrous nonwoven mats were measured using Q800 DMA (TA Instruments).
Rectangular, nonwoven fibrous mats with average dimensions of 15,
5, 0.15 mm (length, width, thickness) were loaded into the DMA using
tension film clamps. An isothermal stress–strain, displacement
ramp test was conducted at 23 °C, with a 0.001 N preload, 0.1%
initial strain, and a 1 mm/min ramp rate.
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5

Analyzing Composite Fracture Surfaces

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The impact fracture surfaces
of the composites were observed using scanning electron microscopy,
a Phenom ProX SEM (Phenom-World, The Netherlands) with a 15 kV acceleration
voltage. Prior to imaging, samples were gold sputter coated for 5
s using a 108 manual sputter coater (TED PELLA, Inc). Samples were
prepared for transmission electron microscopy using a Leica RM microtome
(Leica Biosystems, Germany) to cut ∼100 nm thick sections from
the fracture site. A 200 kV field emission TEM (Tecnai G2 F20, FEI)
was used for imaging.
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