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DGEBA is a type of epoxy resin commonly used in laboratory settings. It is a colorless to pale yellow liquid with a mild odor. DGEBA serves as a core component in the formulation of various epoxy-based adhesives, coatings, and composite materials.

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2 protocols using dgeba

1

Synthesis of Hyperbranched Epoxy Resins

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Bisphenol A (BPA) used as A2 monomer for preparing the in-situ generated DGEBA monomer was purchased from Tokyo Chemical Industry Co., Ltd. (Tokyo, Japan) and was purified by recrystallization from toluene before using. Epichlorohydrin (ECH) as epoxidation reagent was obtained from Tokyo Chemical Industry Co., Ltd. Pentaerythritol (PE) used as B4 branch generating unit for reacting with the in-situ generated DGEBA was purchased from Tokyo Chemical Industry Co., Ltd., Japan and was purified by recrystallization from ethanol prior to use. Polyethylene glycol (PEG400, Mw = 400 g/mol) as A2 monomer was purchased from Sigma-Aldrich, St. Louis, MI, USA. Sodium hydroxide (NaOH) as base catalyst and sodium chloride (NaCl) were obtained from Ajax Finechem, Australia. Hydrobromic acid (HBr), acetic acid, potassium hydrogen phthalate, methyl violet, and chlorobenzene were used to determine epoxy equivalent weight (EEW) of the hyperbranched epoxy resins and were purchased from Tokyo Chemical Industry Co., Ltd., Japan. Diethylenetriamine (DETA) as amine curing agent was brought from Tokyo Chemical Industry Co., Ltd., Japan. Solvents were analytical grades and used as received.
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2

Synthesis and Characterization of Zeolitic Imidazolate Frameworks

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Glycidyl
phenyl ether (GPE),
hexahydro-4-methylphthalic anhydride (MHHPA), and 2,2-bis(4-glycidyloxyphenyl)propane
(DGEBA) were purchased from Tokyo Chemical Industries, Co., Ltd. (Tokyo,
Japan). Zeolitic imidazolate frameworks comprising ZIF-8,17 (link) ZIF-14,18 (link) ZIF-7,19 (link) and ZIF-1120 (link) were
prepared as described elsewhere. Solvents and other chemicals were
used as received without further purification. The mold releasing
agent, Daifree GA-7500, was purchased from Daikin Industries Ltd.
(Osaka, Japan). The microencapsulated latent thermal initiators, HX-3088
and HX-3722, were obtained from Asahi Kasei Co. Ltd. (Tokyo, Japan).
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