A straight single-layer PDMS microchannel was fabricated using a conventional soft lithography and mould replica technique. A silicon master mould for the microchannel was patterned using a positive photoresist (Shipley 1827, MicroChem, USA) and etched. The mould was then vapour coated with 1H,1H,2H,2H-perfluorooctyltrichlorosilane (Sigma Aldrich, USA) such that the master mould does not disintegrate and to avoid any subsequent damage to the PDMS channel during the demoulding process. Sylgard 184 Silicone Elastomer Base and Sylgard 184 Silicone Elastomer Curing Agent (Dow Corning, USA) were mixed at a 10:1 (weight:weight) ratio and cast onto the silicon mould. The uncured PDMS on the silicon mould was then degassed in a vacuum desiccator for 2 h to remove any air microbubbles and later cured at 65 °C for 2 h. After gently removing the cured PDMS from the silicon mould, the inlets and the outlets were punched into the PDMS using a reusable biopsy punch (Harris Uni-Core, Ted Pella, USA). Then, the PDMS device was bonded to the cover glass after plasma treatment.
Shipley 1827
Manufactured by MicroChem
Sourced in United States
The Shipley 1827 is a positive photoresist designed for use in microelectronics and semiconductor manufacturing processes. It is a liquid photoresist material that is applied to the surface of a substrate, such as a silicon wafer, and then exposed to ultraviolet light through a mask to create a desired pattern. The exposed areas of the photoresist are then removed using a developer solution, leaving behind the desired pattern on the substrate surface.
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2 protocols using shipley 1827
1
Fabrication of PDMS Microchannels
2
Fabrication of Unshrunk and Shrunk Au-Coated Polyolefin Films
Check if the same lab product or an alternative is used in the 5 most similar protocols
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The unshrunk and shrunk Au-coating polyolefin films were fabricated following our previous study.28,29 (link) First, polyolefin films were cut into 70 mm × 70 mm squares and then adhered to silicon wafer substrates using 70% ethanol and Kapton tape. Next, a 40 nm of gold (Q150R S, Quorum Technologies) was deposited onto the above substrate, followed by subsequently photopatterned using Shipley 1827 (Microchem) positive resist and UV exposure (MA6, Suss Microtec) via a photomask. Following this step, the wafers in I2 : KI : H2O (1 : 4 : 40) gold etchant was wet etched in order to remove the areas of gold that were exposed through the photolithographic patterning. Finally, acetone was applied to such surface to remove the remaining photoresist.
In order to obtain a well-defined gold geometric area, a polytetrafluoroethylene (PTFE) solution was applied to provide an insulation coating on the long gold electrodes, leaving only the hexagonal gold area for sensor immobilization. After dropcasting the Teflon solution on this substrate, it was left at ambient conditions for 30 minutes to dry out. With these, an unshrunk, planar gold film was obtained. To fabricate the shrunk, wrinkled electrode, the former film was baked in the oven at 150 °C for 5 min.
In order to obtain a well-defined gold geometric area, a polytetrafluoroethylene (PTFE) solution was applied to provide an insulation coating on the long gold electrodes, leaving only the hexagonal gold area for sensor immobilization. After dropcasting the Teflon solution on this substrate, it was left at ambient conditions for 30 minutes to dry out. With these, an unshrunk, planar gold film was obtained. To fabricate the shrunk, wrinkled electrode, the former film was baked in the oven at 150 °C for 5 min.
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