Shipley 1827
The Shipley 1827 is a positive photoresist designed for use in microelectronics and semiconductor manufacturing processes. It is a liquid photoresist material that is applied to the surface of a substrate, such as a silicon wafer, and then exposed to ultraviolet light through a mask to create a desired pattern. The exposed areas of the photoresist are then removed using a developer solution, leaving behind the desired pattern on the substrate surface.
2 protocols using shipley 1827
Fabrication of PDMS Microchannels
Fabrication of Unshrunk and Shrunk Au-Coated Polyolefin Films
In order to obtain a well-defined gold geometric area, a polytetrafluoroethylene (PTFE) solution was applied to provide an insulation coating on the long gold electrodes, leaving only the hexagonal gold area for sensor immobilization. After dropcasting the Teflon solution on this substrate, it was left at ambient conditions for 30 minutes to dry out. With these, an unshrunk, planar gold film was obtained. To fabricate the shrunk, wrinkled electrode, the former film was baked in the oven at 150 °C for 5 min.
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