Yellow dual cartridge

SoC devices were manufactured using the micromilling-replica moulding (μMi-REM) technique, following the protocol described by Carugo et al.³⁶ (link) Briefly, a positive mould was first created by casting epoxy adhesive resin (yellow dual cartridge, RS Components Ltd., UK, at 1:1 weight ratio between components) over a negative PMMA mould. Liquid polydimethylsiloxane (PDMS, Sylgard^® 184, Dow Corning Corporation, USA, curing agent:monomer ratio of 1:10 by weight) was then poured over the positive mould and allowed to solidify (at 65 °C overnight). Subsequently, the PDMS layer containing the SoC channel architecture was permanently sealed to a 1 mm thick microscopic glass slide (70 mm × 50 mm, Sigma-Aldrich^®, USA), by treatment with oxygen plasma (plasma asher TePla 300, PVA-TePla^®, Germany). Upon completion of the manufacturing process, devices were employed without any chemical treatment of their inner surfaces.

Poly(dimethylsiloxane) (Sylgard® 184) was purchased from Dow Corning Corporation (Michigan, USA), and poly(methyl methacrylate) from theplasticshop.co.UK (Coventry, UK). Epoxy adhesive (Yellow Dual Cartridge) was purchased from RS Components Ltd. (Corby, UK). Poly(lactic-co-glycolic acid), Pluronic® F127, dichloromethane, polyoxyethylene (40) stearate, trichloro-(1 H, 1 H, 2 H, 2 H-perfluorooctyl)-silane, and Evans blue dye were purchased from Sigma Aldrich (Gillingham, UK). Phosphate buffered saline was purchased from Life Technologies (Thermo Fisher Scientific Inc., Massachusetts, USA) and 1,2-distearoyl-sn-glycero-3-phosphocholine from Avanti Polar Lipids (Alabama, USA). Perfluorohexane was purchased from Apollo Scientific Ltd. (Stockport, UK). Nitrogen (N₂) gas was provided by The BOC Group plc (Guildford, UK).