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Grand arm 300

Manufactured by JEOL
Sourced in Japan

The Grand ARM 300 is a high-resolution analytical transmission electron microscope (TEM) designed for advanced materials characterization. It features a stable electron beam and a highly sensitive detection system, enabling detailed observation and analysis of nanoscale structures and compositions.

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6 protocols using grand arm 300

1

Advanced Microstructural Characterization of Materials

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The morphology and composition measurements are performed on the Zeiss Gemini 450 equipped with an EDS (Ultim Extreme, Oxford, UK). XRD patterns are obtained on the Bruker D8 Discover (Germany) with a monochromatic Cu radiation source (λ = 0.15406 nm). The X-ray profiles are recorded in θ–2θ scan mode with 2θ∈(10°, 80°). Cross-section TEM specimens are prepared by dual-beam FIB system (Helios G4 UX, FEI, USA) using Ga-ion accelerating voltage ranging from 2 to 30 kV, followed by ion-milling (Gatan 691, Gatan, USA) operated at 2 kV to remove the residual amorphous layer. TEM images and EDS analysis are acquired at 200 kV using a JEM-2100F JEOL equipped with an Oxford EDS detector (X-Max 80 T, Oxford, UK). Atomic-resolution imaging measurements are performed on an aberration-corrected HAADF STEM (AC-HAADF-STEM) (JEOL Grand ARM300, Japan) equipped with JEOL dual 158 mm2 SDD detectors for atomic level EDS analysis. To improve the signal-to-noise ratio and minimize the drift or distortion of AC-HAADF-STEM images, six serial frames are acquired with a short dwell time (2 μs·pixel−1). The image series are aligned and superimposed.
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2

Advanced Microscopy Techniques for Material Analysis

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AFM imaging was performed using the Asylum Research Cypher S system. Raman and PL spectra were collected using the Horiba Jobin Yvon LabRAM HR-Evolution Raman system with an excitation laser wavelength of 532 nm. SAED was performed in a STEM (JEOL Grand ARM 300 CFEG) operating at 80 kV and atomic-resolution images were achieved using an aberration-corrected scanning transmission electron microscope Grand ARM 300 (JEOL) operating at 80 kV.
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3

Atomic-Resolution STEM Analyses

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STEM
analyses were carried out on a JEOL Grand ARM 300, equipped with a
cold field-emission gun (cold FEG) and operated at 300 kV. The column
was fitted with a JEOL double spherical aberration corrector, which
was aligned prior to the analyses to assure a maximum spatial resolution
of 0.7 Å in the scanning mode. The microscope was also equipped
with a JEOL EDS and a Gatan Quantum Energy Filter for spectroscopic
measurements.
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4

Characterizing Thin Film Nanostructures via TEM

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Cross-sectional TEM specimens were prepared by focused ion beam (FIB, Helios G4UX, FEI, America). In order to protect the thin film, a ~50 nm thick C layer was coated on the surface of the film before the FIB milling. HRTEM observations were carried out using a field emission microscope (JEM-2100F, JEOL, Japan) at an acceleration voltage of 200 kV. Further HAADF imaging, EDS mapping, and EELS analyses were performed with an Cs-corrected STEM operating at 300 kV (Grand ARM-300, JEOL, Japan) equipped with an X-ray energy dispersive spectrometer (JED-2300T) and Gatan image filter (GIF) system. In EELS analyses, an entrance aperture of 2.5 mm was used and the energy resolution of 1.0 eV was determined by measuring the full-width half-maximum (FWHM) of the zero-loss peak with the energy dispersion of 0.25 eV/channel. The EELS spectra were recorded with spectrum image mode to increase the signal/noise ratio, and the acquisition time was about 0.2 s per pixel (total acquisition time is about 3 min).
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5

In-situ Atomic-scale Biasing TEM Analysis

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TEM samples were prepared on a dual-beam FIB system (Helios G4 UX, FEI, USA).
The atomic-scale in-situ biasing TEM analyses were performed on a Cs-TEM (JEOL Grand ARM300, Japan) with a PicoFemto double tile biasing TEM holder (ZEOTools Technology Company) at HRTEM mode. A tungsten tip was used as the mobile electrode, which was precisely controlled by a piezoelectric system. The in-situ videos were obtained using Gatan OneView camera with 4 k resolution by a speed of 25 frames/s. The in-situ video was drift-corrected and processed by using GM3 in-situ data processing. The HRTEM snapshots corresponding to different external voltages were extracted from the in-situ video and filtered to remove the high-frequency noise (Supplementary Movies 1 and 2).
Atomic-resolution imaging measurements before and after biasing were performed on the Cs-TEM at the AC-HAADF-STEM mode. Atomic-scale polarization switching under e-beam illumination was observed with the spot size of 8 C with a probe current of 23 pA or 6 C with 30 pA.
The simulated HAADF-STEM images were performed using MacTampas software. The simulated SAED patterns were obtained using CrystalKitX software.
Detailed atomic arrangement analyses for HAADF-STEM images combined with atomic quantification were performed using the Calatom software based on custom MATLAB scripts.
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6

High-Resolution Electron Microscopy Imaging

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Electron microscopy analyses were performed in a coldFEG JEOL Grand ARM 300 electron microscope. The microscope was equipped with a double corrector from JEOL assuring a spatial resolution of 0.7 Å when operated at 300 kV. Before observation, the samples were deeply crushed using a mortar and pestle and dispersed in ethanol. A few drops of the suspension were deposited on a holey carbon copper microgrids. For imaging, both Annular Dark Field and Annular Bright Field detectors were used simultaneously, acquiring data in both detectors.
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