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Q50 tga analyzer

Manufactured by TA Instruments
Sourced in United States

The Q50 TGA analyzer is a thermogravimetric analysis instrument used to measure the change in the weight of a sample as a function of temperature or time. It provides quantitative information about physical and chemical changes that involve mass loss or gain.

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15 protocols using q50 tga analyzer

1

Quantifying Residual Solvent in Dry Powder

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The amount of residual solvent present in the dry powder formulation was investigated using a TGA Q50 analyzer (TA Instruments, New Castle, DE, USA). A specific amount (2–3 mg) of powder was loaded on the TGA pan and heated until 120 °C from room temperature (22 ± 3 °C) with a fixed temperature rise (10 °C/min). The residual solvent present in the dry powder was determined from the weight loss of the powder. An inbuilt software (Version 4.3, TRIOS) of the TGA analyzer was used to determine the weight loss. The tests were performed twice.
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2

Quantifying Ivermectin Moisture Content

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The water content of ivermectin raw material and prepared ivermectin dry powders was assessed by thermogravimetric analysis with a TGA Q50 analyzer (TA Instruments, New Castle, DE, USA). Around 2–5 mg of sample (raw material or dry powder formulations) was taken to a TGA pan. The samples were then heated at a constant temperature increment (10 °C/min) from ambient temperature to 120 °C. The water content was determined based on the weight loss of the samples using the inbuilt software (TRIOS) of the instrument. The tests were performed twice for each formulation.
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3

Thermogravimetric Analysis and Scanning Electron Microscopy

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Thermogravimetric analysis (TGA) was performed using the TGA Q50 analyzer (TA Instruments, USA) in a N2 environment at a heating rate of 10 °C min−1 from 30 to 800 °C. Electronic micrographs of the composite film and waveguide on the silicon substrate were taken on a field emission scanning electron microscopy (JSM-7600F, JEOL Ltd., Japan).
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4

Characterization of Coumarin-6 Thin Films

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TGA experiment of coumarin-6 powder was carried out by using a TA Instrument TGA Q50 analyzer under a flow of nitrogen gas with a heating rate of 10 °C/min. The surface morphology as well as the thickness of the as-deposited coumarin-6 polycrystalline film was taken by a JOEL JSM-6335F field emission scanning electron microscopy (SEM). X-ray diffraction (XRD) analysis on coumarin-6 polycrystalline film or powder was performed on a Bruker D8-Advance with Cu-Kα emission and with a scanning increment of 0.0149°. Optical transmission (OT) through coumarin-6 film was taken by a scanning monochromator (ARC SpecrroPro-500) with a tungsten-halogen lamp as the light source. The optical transmittance intensity IOT and the original incident light intensity I0 were measured by an optometer (Graseby UDT S370) with wavelength correction. Then, the normalized OT spectrum was obtained by dividing IOT by I0 at each photon energy position. PL spectrum on the coumarin-6 film was performed with exciting by a focused diode laser of 403 nm. The collected luminescence from coumarin-6 film was dispersed by a spectrometer (Jobin Yvon/Spex TRIAX 550) and then detected with a photomultiplier tube. The temperature of the sample site during the OT and PL measurements was controlled by a cryostat system.
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5

Comprehensive Characterization of Materials

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Powder X-ray diffraction (PXRD) was performed on a Bruker D8 Venture diffractometer using Cu Kα radiation (λ = 1.5418 Ã…). Thermogravimetric analysis (TGA) was performed using a TA Instruments TGA-Q50 analyzer at a constant heating rate of 5 °C/min from 25 to 800 °C. UVâ€"vis spectra were measured using a JASCO J-715 spectrometer. FT-IR spectra were recorded on a PerkinElmer Spectrum Two spectrometer. HPLC measurements were carried out on a Shimadzu HPLC system with a Chiralcel OD-H column using a flow rate of 1 mL/min.
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6

Thermal Decomposition of Flame-Retardant FWPC

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To investigate the effect of flame-retardant treatment processes on the thermal decomposition behaviors of FWPC, TGA analysis was conducted. All TGA tests were recorded on a Q50 TGA analyzer (TA Instruments, USA) at a linear heating rate of 10 °C min−1 under a nitrogen atmosphere. The temperature ranged from ambient temperature to 700 °C. Before the test, each sample was grounded into powders and kept with 5 mg in an open platinum pan.
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7

Characterization of Polymer-Grafted Silica Particles

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Assessment of the
grafting density and inorganic content of particles was made using
weight fractions measured from thermogravimetric analysis (TGA) on
a Q50 TGA analyzer from TA Instruments under nitrogen up to 850 °C.
Grafting density was calculated by using the weight fractions measured
with TGA to convert to number of polymer chains using the molar mass
of polymer chains (as determined using size exclusion chromatography)
and surface area (using a silica mass density of 1.85 g/cm3). The silica core was the same for all four particle brushes with
radius Rc = 57 ± 3 nm as determined
by TEM. The particle shape and size in the dry state were inferred
from SEM images (Supporting Information), indicating spherical PS shell and revealing both molecular weight
and grafting density thickness dependence. In addition, an estimate
of the PS height, h, was obtained from the center-to
center distance d = 2(Rc + h) in the TEM images of the assembled particle
brush films.26 (link) Given the different thermodynamic
conditions, bad (air) and theta (film) solvent conditions, the two
estimates of h can be different.
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8

Thermal Analysis of Biomaterials

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TGA profiles of Na-Alg, CMC-Na, and C-A1C3 were obtained using a Q50 TGA analyzer (TA Instruments, New Castle, Delaware, USA) equipped with platinum pans. The profiles were collected in an inert atmosphere of nitrogen from 40 to 600 °C. The heating rate was uniform at 10 °C/min throughout analysis.
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9

Thermal Stability Analysis of SPI Films

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The Q50 TGA analyzer (TA Instrument, New Castle, DE, USA) was carried out to investigate the thermal stability of SPI-based films. Each sample was dried at 105 °C for 24 h in an air-circulating oven before testing. Film specimens were scanned from 25 to 600 °C at a heating rate of 10 °C/min under a nitrogen atmosphere (100 mL/min).
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10

Thermal Stability Evaluation of WPCs

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The thermal stability of WPCs was evaluated by TGA (Q50 TGA analyzer, TA Instruments Ltd., New Castle, DE, USA). Each formulation (about 7 mg) was tested under a nitrogen flow (40 mL/min) at a linear heating rate of 20 °C/min from room temperature up to 700 °C.
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