A professional laboratory equipment DLP-SLA Envisiontec Perfactory P3 Mini Multilens, that uses a 60 mm lens system, a work tray of 84 × 63 × 230 mm, and a layer resolution between 15 µm and 150 µm was employed to generate the molds using ABS Flex White, HTM 140, E-Dent 400, ABS Flex Black, and E-Partial. These materials were post-processed in an Otoflash pulse curing chamber of the same supplier (11 W lamp with a wavelength between 300 and 700 nanometers and ten pulses per second).
A benchtop SLA-LF Form 3 additive manufacturing equipment from Formlabs was used employing a 25 µm for the Clear V04 and 50 µm resolution setting for the Flexible V02 resin. Samples were cured using the provider’s recommended settings for post-processing the sample accordingly (15 min at 60 °C and 1 h of exposure to UV light).
Additionally, a 3D Systems ProJet 6000 that works with an ultraviolet laser was employed by a service provider [42 ] to develop devices in Accura SL 5530 resin. The thermoset resin selected for the molds was a high-temperature resistant stereolithography material, Accura SL 5530 (3D Systems, Rock Hill, SC, USA). A post-curing process was performed to the mold by exposing it for 90 min to UV light and baking it at a temperature of 160 °C for 2 h.
A benchtop SLA-LF Form 3 additive manufacturing equipment from Formlabs was used employing a 25 µm for the Clear V04 and 50 µm resolution setting for the Flexible V02 resin. Samples were cured using the provider’s recommended settings for post-processing the sample accordingly (15 min at 60 °C and 1 h of exposure to UV light).
Additionally, a 3D Systems ProJet 6000 that works with an ultraviolet laser was employed by a service provider [42 ] to develop devices in Accura SL 5530 resin. The thermoset resin selected for the molds was a high-temperature resistant stereolithography material, Accura SL 5530 (3D Systems, Rock Hill, SC, USA). A post-curing process was performed to the mold by exposing it for 90 min to UV light and baking it at a temperature of 160 °C for 2 h.