Photolithography on the Si substrates (single side polishing) was performed by a mask aligner (ABM/6/350/NUV/DCCD/M) using SU-8 photoresist (MicroChem 2015) according to following steps. First, SU-8 photoresist was spin-coated on the polished surface of Si substrate at 6000 rpm for 60 s, then prebaked at 95 °C for 3.5 min. Second, photolithography on the SU-8 photoresist was performed by exposing the substrate under UV irradiation (the irradiance density is 15 mW cm−2) for 5 s with a mask. After postbaking at 95 °C for 4 min, the photoresist was developed in the developer for 60 s and rinsed in water for 5 s, then obtaining the photoresist micropillars. Finally, the pattern SU-8 photoresist was cured by hard baking for 15 min at 150 °C and exposing it under UV irradiation for its full crosslinking, then yielding stable 1D photoresist micropillars with high mechanical strength and high swelling resistance.
Su 8 photoresist
Manufactured by MicroChem
Sourced in United States, Japan, Morocco
SU-8 is a negative, epoxy-based photoresist designed for microfabrication applications. It is a high-contrast, chemically amplified resist that is sensitive to near-UV and UV light. SU-8 is commonly used for the creation of high-aspect-ratio microstructures and has a wide range of applications in fields such as microelectronics, microfluidics, and MEMS.
Automatically generated - may contain errors
Lab products found in correlation
Sylgard 184, by Dow (22 mentions)
Autocad, by Autodesk (7 mentions)
Sylgard 184 silicone elastomer kit, by Dow (7 mentions)
Harris uni core, by Ted Pella (3 mentions)
Su 8 developer, by MicroChem (2 mentions)
Polydimethylsiloxane pdms, by Dow (2 mentions)
Fetal bovine serum (fbs), by Thermo Fisher Scientific (2 mentions)
Trypsin, by Thermo Fisher Scientific (2 mentions)
Mfcs ez, by Fluigent (2 mentions)
Novec 7500, by 3M (2 mentions)
Glass bottomed six well culture dishes, by MatTek (2 mentions)
Glass slide, by Corning (2 mentions)
γ butyrolactone, by Merck Group (2 mentions)
Falcon petri dishes, by BD (2 mentions)
Poly acrylic acid, by Polysciences (2 mentions)
Polycarbonate plates, by McMaster-Carr (2 mentions)
Fibronectin, by BD (2 mentions)
N methyl pyrrolidone (nmp), by Avantor (2 mentions)
Az 5214e resist, by MicroChem (2 mentions)
Slygard 184, by Dow (1 mentions)
81 protocols using su 8 photoresist
1
Fabrication of SU-8 Photoresist Micropillars
2
Soft-lithography Fabricated Microfluidic Devices
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Microfluidic devices for SFL were fabricated using soft-lithography. The polydimethylsiloxane elastomer (PDMS; Sylgard 184, Dow Corning) was mixed with a 10% (w/w) curing agent. The PDMS and curing agent mixture were rigorously mixed and poured over the (+) patterned silicon master wafer (SU-8 photoresist, Microchem). After 30 minutes for degassing, the (−) patterned PDMS blocks were molded by baking in an oven at 70 °C for about 12 hours. The fully-cured PDMS (−) pattern was detached from the master wafer. The inlet for the precursor injection and outlet for particle recovery were perforated using 1.0 mm and 10.0 mm punches (Miltex), respectively. The PDMS mixed with 10% (w/w) curing agent was coated to glass slides for the bottoms of the microfluidic devices. The thin-coated glass slides were partly cured at 70 °C for 25 minutes. The PDMS (−) patterns with open inlet and outlet were attached to the pre-mentioned bottoms and cured in the oven for at least 6 hours.
3
Fabrication of PDMS Microfluidic Chips
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To fabricate the molds for the microfluidic chip, we used a two-layer photolithography method to create SU8 photoresist (Microchem, Japan) patterns with two heights on the silicon wafer; 6–8 mm thick PDMS was then cast on the silicon wafers and disposed at a curing temperature of 70 °C for 3 h. Then, the PDMS piece was peeled from the silicon wafer, with the shape of the designed structures transferred to the surface of the PDMS piece. After cleaning with Scotch Magic tape (Minnesota Mining and Manufacturing Corporation) and an oxygen plasma treatment, the PDMS piece was bonded to 0.13 mm thick glass and heated overnight at 70 °C. Before cell loading, the chip was degassed in vacuum for 10 min.
4
Fabrication of Spiral Microchannels
5
Fabricating PDMS Microchannels with Nafion Patterning
6
Lung Cancer Cell Culture Optimization
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All cell-culture reagents were purchased from Life Technologies Corporation (Carlsbad, CA, USA) unless otherwise specified. The materials used during device fabrication were SU-8 photoresist (MicroChem Corp., Newton, MA, USA) and 184 silicone elastomer (Dow Corning Corp., Midland, MI, USA). The non-small-cell lung cancer cell line 95C was cultured at 37 °C in 5% CO2 in RPMI 1640 medium supplemented with 10% heat-inactivated fetal bovine serum, 100 units/mL penicillin and 100 μg/mL streptomycin.
7
Fabrication of 3D-AFT Device on LiNbO3
8
Microfluidic Gradient Droplet Device Fabrication
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The microfluidic gradient droplet device was fabricated using a standard soft lithography process as previously reported [22 (link),23 (link)]. Briefly, a photomask of the device was designed by 2D CAD software (AutoCAD, Autodesk Inc., San Rafael, CA, USA), and the oxidized silicon wafer was spin-coated with a SU-8 photoresist (Microchem Corp, Westborough, MA, USA) at 2000 rpm for 60 s to form a thickness of 50 μm. After pre-exposure baking at 95 °C for 20 min, the wafer was exposed to ultraviolet (UV) light for 10 s through the photomask. The resulting wafer was developed using a SU-8 developer (Microchem Corp, Westborough, MA, USA) and cleaned with deionized (DI) water and nitrogen gas. Polydimethylsiloxane (PDMS, Dow Corning, Midland, MI, USA) was mixed in a ratio of 10:1 (monomer: catalyst), degassed, poured onto the wafer, and then cured at 80 °C for 2 h. The PDMS mold was peeled off and bonded onto a glass slide (Marienfeld, Cologne, Germany) using oxygen plasma treatment (Femto Scientific, Hwaseong, Korea). The fabricated device was treated with chlorotrimethylsilane (Sigma-Aldrich, St. Louis, MO, USA) and stored at room temperature before use.
9
Microfluidic Chip Fabrication for Enrichment and Emulsion
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Two kinds of microfluidic chips were used in this study. One is the enrichment microfluidic chip for which the design is described in our previous study (27 (link)), the other is for emulsion according to a previous design (31 (link)). The master molds were fabricated using lithography that creates SU8 photoresist (Microchem, Japan) patterns on a silicon wafer. Prepolymer polydimethylsiloxane (PDMS) (Sylgard 184; Dow Corning Toray, Japan) was cast on the silicon mold to a thickness of 5 mm and cured at 70°C for 3 h. Then, the PDMS layer was peeled off and bonded to glass after oxygen plasma treatment and heated overnight at 70°C. Before experiments, holes of inlets and outlets were punched and connected with conduits, and the device was sterilized by UV light and preinfused with sterile PBS.
10
Fabrication of Microfluidic Devices via Soft Lithography
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Masks were designed using AutoCAD and phototraced on transparent film (Selba S.A., Switzerland). Molds were fabricated using standard multilayer soft lithography techniques. Briefly, microfluidic channels were patterned on 4-inch silicon wafers spin coated with 5 mL of SU-8 photoresist (MicroChem Corp., MA, USA), baked, exposed to UV and developed. After cleaning with isopropanol and dried, molds were covered by a 5 mm layer of polydimethylsiloxane (PDMS, Dow Corning, Sylgard 184) mixed with the curing agent in a ratio 10:1 w/w and baked for 2 hours at 70 °C. After pilling of the PDMS slab, inlets and outlets were drilled with a biopsy puncher of 1.5 mm diameter (Integra Miltex, PA, USA) . The PDMS chip are bound onto a 1 mm thick glass slide (Paul Marienfeld, GmbH & Co. K.G., Germany) sequentially cleaned with acetone and isopropanol, immediately after oxygen plasma exposure. The chips are finally baked at 200°C for 5 hours to make the channels hydrophobic 67 .
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