Ta q800
The TA Q800 is a dynamic mechanical analyzer (DMA) that measures the viscoelastic properties of a wide range of materials. It can characterize the mechanical behavior of solid and semi-solid samples under various temperature, frequency, and stress conditions.
Lab products found in correlation
34 protocols using ta q800
Characterizing Piezoelectric Fiber Properties
Dynamic Mechanical Analysis of PE/ZnO/Wood Composites
Microstructure Analysis of Shape Memory Polymer Composites
Heat Deflection Temperature of Injection Molded Samples
deflection temperature (HDT) of injection molded samples was examined
using a dynamic mechanical analyzer (TA Q800, USA) with a three-point
bending attachment and worked from 30 to 250 °C at 2 °C/min
under 0.455 MPa load. The deflection of 250 μm as mentioned
in the ASTM D 648 standard was monitored. Each sample was repeated
three times, and the values are presented in terms of average ±
standard deviation.
Viscoelastic Characterization of PLA/PBS/WF Biocomposites
Characterization of Advanced Polymer Materials
Characterization of Polymer Separator Films
where W0 is the dry separator and W1 is the soaked one.
Characterization of Polyimide Film Properties
Dynamic mechanical thermal analyses (DMA) of films were measured with a TA-Q800, made by TA Instruments, to evaluate the storage modulus and the tan delta of PI films. The glass transition temperature Tg can be also measures by the inflection point of the storage modulus or the maximum peak of the tan delta. These values are important to fix the process temperature in the shape memory step. DMA tests were performed in the temperature range between 50 and 350 °C, under nitrogen flux and with a heating rate of 5 °C/min. The sample of PI film was cut into long splines with a length of 30 mm and a width of 5.27 mm.
Thermogravimetric analysis (TGA) was performed under nitrogen atmosphere on a Setline Sta instrument made by Setaram company. The TGA test was performed with a heating rate of 10 °C/min from 30 °C to 800 °C.
The mechanical properties of PI films were tested at room temperature on a SANS CMT 4104 tensile apparatus made by MTS company with dumbbell-shaped specimens and with a crosshead speed of 10 mm/min in accordance with GB/T1040.3-2006 [24 (link)].
Characterization of Shape-Memory Properties
Thermal and Dynamic Mechanical Analysis of PLLA Blends
The crystallinity of the PLLA phase was calculated by the following formula:
where is the enthalpy of melting per gram of 100% crystallinity (perfect crystal) of PLA 93.7 J g−1) [40 (link)], and Wf is the weight fraction of PBS in the PLA/PBS binary blends.
The dynamic mechanical properties of PLA/PBS binary and PLA/PBS/PDLA ternary blends were studied by dynamic mechanical analysis (DMA) (TA Instruments, TA Q800, New Castle, DE, USA). The sheets used for DMA analysis were cut into a dimension of 6 × 40 × 0.5 mm3 and vibrated in tension mode at a frequency of 1 Hz. All the DMA tests were carried out from room temperature to 120 °C using a 2 °C/min temperature ramp.
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