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Supra 55vp instrument

Manufactured by Zeiss
Sourced in Germany

The SUPRA 55VP is a high-performance scanning electron microscope (SEM) instrument manufactured by Zeiss. It is designed to provide high-resolution imaging and analytical capabilities for a wide range of materials and applications. The SUPRA 55VP utilizes a field emission gun (FEG) electron source and advanced optics to deliver exceptional image quality and resolution.

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3 protocols using supra 55vp instrument

1

Comprehensive Material Characterization Protocol

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Scanning electron microscopy (SEM) images
were obtained using a SUPRA 55VP instrument (Carl Zeiss, Germany).
X-ray diffraction (XRD) patterns were recorded using a SmartLab 9
automated multipurpose X-ray diffractometer (Rigaku, Japan) with Cu
Kα radiation (λ = 1.54056 Å). X-ray photoelectron
spectroscopy (XPS) measurements were performed using an ESCALAB 250Xi
X-ray photoelectron spectrometer (Thermo Fisher Scientific, USA).
Fourier-transform infrared (FT-IR) spectra were recorded using a Nicolet
380 FT-IR spectrometer (Thermo Fisher Scientific, USA) with KBr as
the background. Raman spectra were obtained using a Renishaw in Via
confocal Raman microscope. Thermogravimetric analysis (TGA) was conducted
with a TGA/DSC 1 instrument (Mettler Toledo, Switzerland). UV–vis
spectra were obtained using a UV-2600 double beam UV spectrophotometer
(Golden Island, Japan).
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2

Morphological and Elemental Analysis of Vanillin Nanocomposites

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The synthesized vanillin nanocomposites were then subjected to FESEM analysis. The surface morphology, shape, and size distribution of the synthesized vanillic acid nanocomposites were examined using FESEM (SUPRA 55VP instrument, Carl Zeiss, Jena, Germany). It was used to capture FESEM images of the nanocomposite at high resolution under various magnifications. Additionally, FESEM coupled with energy-dispersive X-ray analysis was used to analyze the elemental composition.
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3

Multimodal Microscopic Characterization

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Scanning electron
microscopy was performed at a 5 kV acceleration voltage on a Supra
55 VP instrument by Carl Zeiss AG (Oberkochen, Germany) equipped with
an EDX detector after sputter coating the samples with 5 nm of gold
using an EM QSG 100 instrument by Leica Camera AG (Wetzlar, Germany).
Transmission electron microscopy was performed at a 20 kV acceleration
voltage on a CM200 system by Philips GmbH (Vienna, Austria) equipped
with an Orius SC600 CCD camera by Gatan GmbH (Munich, Germany). Carbon
film coated copper grids (200 mesh) were obtained from Plano GmbH
(Marburg, Germany). SEM samples were spotted onto 13 mm Nunc Thermanox
cell culture coverslips from Thermo Fisher Scientific GmbH (Vienna,
Austria). Atomic force micrographs were recorded on a Park NX10 instrument
by Park Systems Corp. (Suwon, South Korea) using a silicon tip with
a nominal radius below 10 nm operating in tapping mode.
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