The morphology of the deposited Li metal at various temperatures was characterized using a FEI Quanta 250 scanning electron microscope (SEM). Cryo-FIB SEM was conducted in a Thermo Scientific Scios 2 DualBeam FIB/SEM. The images were taken at 5 kV in the SEM mode. NMR spectroscopy was conducted on a Varian Inova 500 MHz NMR spectrometer using an SW Probe tunable to O17 and Li7. XPS was carried out using a AXIS Supra by Kratos Analytical with an Al monochromatic anode source at 15 kV with a 5.0 × 10-8 Torr vacuum level. All the peaks were fitted based on the reference C–C bond at 284.6 eV. Raman spectroscopy was conducted on a Renishaw inVia Raman Microscope which utilized a 532-nm laser as an excitation source and a high-resolution 1,800 groove/mm grating. Detailed sample preparation and characterization methods are provided in SI Appendix .
Scios 2 dualbeam fib sem
Manufactured by Thermo Fisher Scientific
The Scios 2 DualBeam FIB/SEM is a high-performance focused ion beam (FIB) and scanning electron microscope (SEM) system designed for precise materials analysis and sample preparation. It combines a gallium ion beam and an electron beam in a single platform, allowing users to image, analyze, and modify samples at the nanoscale.
Automatically generated - may contain errors
Lab products found in correlation
Axis supra, by Shimadzu (1 mentions)
Inova 500 mhz nmr spectrometer, by Agilent Technologies (1 mentions)
Quanta 250 scanning electron microscope, by Thermo Fisher Scientific (1 mentions)
Invia raman microscope, by Renishaw (1 mentions)
Empyrean x ray diffractometer, by Malvern Panalytical (1 mentions)
Sc1000 ccd camera, by Ametek (1 mentions)
Nanoscope 5 multimode setup, by Bruker (1 mentions)
Jem 2100f field emission gun, by JEOL (1 mentions)
2 protocols using scios 2 dualbeam fib sem
1
Characterization of Deposited Li Metal
2
Structural Characterization of Nanomaterials
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The as-prepared samples
were characterized by means of X-ray diffraction (XRD), atomic force
microscopy (AFM), and transmission electron microscopy (TEM). Out-of-plane
θ-2θ diffractograms were acquired for 2θ angles
of 10°–90° on an Empyrean X-ray diffractometer (Malvern
Panalytical, UK) using a hybrid Kα monochromator of type 2XGe(220)
on the incident beam side and a GaliPIX3D area detector in scanning
line mode on the diffracted beam side. AFM images of the sample surface
were recorded on a Nanoscope V multimode setup (Bruker) and analyzed
using Gwyddion.16 (link) An electron-transparent
lamella for TEM imaging was prepared via standard lift-out techniques
on a Thermo Fisher Scios 2 DualBeam FIB/SEM, operating with a Ga-ion
beam at 30 kV accelerating voltage. After thinning at 30 kV, a final
low-voltage cleaning step was performed at 5 and 2 kV to reduce the
extent of superficial amorphization on the lamella. All TEM measurements
were carried out on a JEOL JEM-2100F field-emission gun microscope
equipped with an image-side spherical aberration corrector, operating
at an accelerating voltage of 200 kV. TEM images were recorded using
a Gatan Orisu SC1000 CCD camera. High-resolution TEM images were post-processed
using an average background subtraction filter (ABSF).
were characterized by means of X-ray diffraction (XRD), atomic force
microscopy (AFM), and transmission electron microscopy (TEM). Out-of-plane
θ-2θ diffractograms were acquired for 2θ angles
of 10°–90° on an Empyrean X-ray diffractometer (Malvern
Panalytical, UK) using a hybrid Kα monochromator of type 2XGe(220)
on the incident beam side and a GaliPIX3D area detector in scanning
line mode on the diffracted beam side. AFM images of the sample surface
were recorded on a Nanoscope V multimode setup (Bruker) and analyzed
using Gwyddion.16 (link) An electron-transparent
lamella for TEM imaging was prepared via standard lift-out techniques
on a Thermo Fisher Scios 2 DualBeam FIB/SEM, operating with a Ga-ion
beam at 30 kV accelerating voltage. After thinning at 30 kV, a final
low-voltage cleaning step was performed at 5 and 2 kV to reduce the
extent of superficial amorphization on the lamella. All TEM measurements
were carried out on a JEOL JEM-2100F field-emission gun microscope
equipped with an image-side spherical aberration corrector, operating
at an accelerating voltage of 200 kV. TEM images were recorded using
a Gatan Orisu SC1000 CCD camera. High-resolution TEM images were post-processed
using an average background subtraction filter (ABSF).
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