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Nexsa surface analysis system

Manufactured by Thermo Fisher Scientific

The Nexsa surface analysis system is a state-of-the-art instrument designed for comprehensive surface characterization. It provides high-resolution imaging and chemical analysis capabilities for a wide range of materials and samples.

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4 protocols using nexsa surface analysis system

1

Comprehensive Material Characterization

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Optical observations and Raman tests were conducted using a confocal microscope system (WITec, alpha 300 R). TEM and SAED images were obtained from a FEI Tecnai T20. HAADF-STEM images were acquired by a JEOL JEM-ARM300F TEM. XRD and XPS spectra were collected by a Bruker D8 Advance and a Nexsa surface analysis system (Thermo Scientific), respectively. Surface topography and near-field images were captured using a commercial s-SNOM (NeaSNOM, NeaSpec GmbH) setup with an atomic force microscope tip (NanoWorld, Arrow-NCPt) in tapping mode (~270 kHz frequency and ~70 nm amplitude). To eliminate edge-excited polaritons, flakes were rotated till the incident polarization was parallel to the edges.
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2

Comprehensive Nanostructure Characterization

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The morphology of the nanostructures was characterized by using field emission scanning electron microscopy (FESEM, FEI Nova Nano SEM-450). The samples were drop casted on a clean silicon wafer and dried in air. The characteristics of the samples were studied further by using transmission electron microscopy (TEM, FEI Tecnai G2 20 S-TWIN) imaging as well as atomic force microscopy (AFM, AFM Dimension ICON, Bruker) imaging. Solid state analysis was carried out using powder X-ray diffraction (PXRD) recorded with Cu Kα used as an X-ray source (λ = 1.54 Å) by using a Smart Lab 9 kW rotating anode X-ray diffractometer. X-ray photoelectron spectroscopy (XPS) analysis was performed using a Thermo Scientific NEXSA SURFACE ANALYSIS System. Inductively coupled plasma mass spectrometry (ICP-MS) analysis was carried out by using an Element XR system (Thermo Fischer Scientific, Germany) coupled to a 7500a ICP mass spectrometer (SAIF, IIT Bombay, India).
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3

XPS Analysis of Surface Composition

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XPS data were collected using a Thermo Scientific Nexsa Surface Analysis System equipped with a hemispherical analyser under pressure between 10−9 and 10−8 mbar using monochromatic Al Kα X‐ray beam (1486.6 eV) at 72 W (12 kV×6 mA) at an incident angle of 45°. A low‐energy dual‐beam (ion and electron) flood source was used for charge neutralisation. The X‐ray spot size was 400 μm×800 μm. For survey scans, the pass energy, voltage step size and dwell time were 200 eV, 1 eV and 10 ms, respectively. For the high‐resolution scans, these parameters were 50 eV, 0.1 eV and 50 ms, respectively, typically yielding a full width at half maximum (FWHM) value of 0.86–0.87 eV for the Ag 3d5/2 peak and <1.0 eV for the main C 1s peak in PET during performance tests.
The samples were analysed at a nominal photoelectron emission angle of 0° with respect to the surface normal. Since the actual emission angle is ill‐defined in the case of rough surfaces as in the present case (ranging from 0° to 90°) the sampling depth may range from 0 to approximately 10 nm. Data processing was performed using Avantage software version 5.9902. All elements presented were identified from survey spectra. All binding energies were charge corrected to the adventitious C 1s peak at 284.8 eV. At least two different spots on each sample were probed to ensure the consistency of the results.
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4

Comprehensive Thin-Film Material Analysis

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Thin-film thickness was evaluated using a Bruker DektakXT profilometer, the standard deviation calculated on the average of 7 measurements at different points. The optical band gaps were evaluated by measuring the transmission spectra with a PerkinElmer Lambda 950 spectrometer equipped with an integrating sphere. The absorption coefficient (α) was calculated using the relation α(λ) = 1/t ln(1/T(λ)), where t is the sample thickness and T(λ) is the transmittance. The optical band gap was determined by plotting (αhν)2 versus hν and fitting the linear region of the absorption edge (OriginPro 2020b). X-ray diffraction (XRD) measurements were performed on a D5000 X-ray Powder Diffractometer (Siemens), using Cu-Kα radiation. Raman spectroscopy was performed using a Renishaw inVia confocal Raman microscope, equipped with a 785 nm laser; data analysis was performed by using OriginPro 2020b. X-ray photoelectron spectroscopy (XPS) measurements were performed with a Thermo Scientific™ Nexsa™ Surface Analysis System, and the XPS spectra were recorded and processed using the Thermo Avantage software. An FEI Inspect-F scanning electron microscope (SEM) was used for imaging at an accelerating voltage of 10 kV.
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