Example 5
Characterization of Printed Patterns: The width of the printed lines was measured from optical micrographs obtained on an Olympus optical microscope. The line thickness was measured using a Bruker Contour GT 3D Optical Microscope. For line thickness measurements and height profiles, the height data were averaged over 0.3 to 2 mm of line length to average out the substrate roughness. Statistics for line thickness were based on ˜25 measurements for each data point, and statistics for line width were based on 10 measurements for each data point. For electrical measurements and AFM/SEM images, the patterns were annealed at 250° C. for 30 minutes in a tube furnace, with a stepped temperature ramp to avoid temperature overshoot. For SEM images, a 5 nm film of Au was sputtered onto the samples to mitigate charging effects. SEM images were obtained on a Hitachi SU8030 Field Emission SEM. AFM images were obtained using a Bruker ICON PT AFM System in tapping mode with a Veeco Model RTESP (MPP-11100-10) cantilever. Line resistance was measured using a two-probe measurement technique with Au probes, such that the contact resistance was negligible. Measurements of the evolution of film thickness with annealing were performed on inkjet-printed films on Si/SiO2 using a Dektak 150 Stylus Surface Profiler.