Lfa 427
The LFA 427 is a thermal conductivity measurement device. It is designed to measure the thermal conductivity of solid and liquid samples across a wide range of temperatures. The instrument operates based on the transient hot wire method to determine the thermal conductivity of the sample.
Lab products found in correlation
9 protocols using lfa 427
Characterization of Al/GO Composites
Thermal Diffusivity of Basalt Glasses
was measured by the laser flashing method using a Netzsch LFA 427
instrument. The basalt glasses were made into a square sample (10
× 10 × 1.5 mm), and the measurement was carried out under
an argon atmosphere at a heating rate of 2.5 °C/min. Three valid
data were collected at each temperature point between 200 and 1000
°C, and each presented experimental result represents the average
of three measured values at the same temperature. The thermal conductivity
(λ) of the prepared glasses was calculated by multiplying thermal
capacity (ρ × Cp) and thermal
diffusivity (α), which can be expressed by
Characterization of CS@Ag Core-Shell Fibers
Measuring Thermal Properties of Ceramic Materials
To eliminate the influence of the porosity, the thermal conductivities of fully dense specimens (k) were calibrated by [30 ,34 (link)]:
Characterization of Thermoelectric Materials
The electrical properties including the Seebeck coefficient and electrical conductivity were measured using a custom-made testing apparatus developed by the 18th Research Institute of China Electronics Technology Group Corporation. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TG) were carried out using a NETZSCH STA 449 F5 Jupiter instrument. The Hall effect testing apparatus, HET-HT model, was utilized for measuring the carrier concentration of the samples. The thermal diffusivity(λ) and specific heat capacity (Cp) of the samples were determined by the laser flash method (NETZSCH®, LFA427, Netzschkau, Germany), the density(ρ) was measured by the Archimedes’ method, and finally, the thermal conductivity(κ) was calculated using the corresponding formula (κ = λ·Cp·ρ).
Comprehensive Characterization of Sustainable PEG-based Phase Change Materials
plasma emission spectrometer (Agilent ICPOES730) was used to detect
the cation content of the AEVM leaching solution. SEM (ZEISS SUPRA55)
was applied to observe the morphologies of EVM, AEVM, and the ss-CPCMs.
FT-IR (Nicolet iS10, wavenumber: 4000–400 cm–1) examined the chemical compatibility of ss-CPCMs. XRD (Bruker D8
Advance, Cu Kα radiation, 2θ: 3–90°, scanning
rate: 6°/min) patterns were employed to investigate the crystal
phases of PEG, AEVM, C, and PAEC ss-CPCMs. The distribution of pore
diameter and porosity of EVM and AEVM were analyzed using a mercury
intrusion meter (Micromeritics, AutoPore IV 9500). TES properties
of PEG and the ss-CPCMs were determined by using DSC (NETZSCH Q20,
heating and cooling rate: 5 °C/min, atmosphere: N2). Each sample of PEG and ss-CPCMs was measured three times to use
the average value as the result. Thermal stability of PEG and ss-CPCMs
was tested by using TGA and DTG (Q5000, TA, USA, test range: 30–650
°C, heating rate: 10 °C/min, atmosphere: N2).
The thermal conductivity of samples was determined by using a laser
thermal conductivity tester (LFA-427, NETZSCH, Germany) at 25 °C.
Each sample was tested three times under the same conditions, and
the mean value was demonstrated in here. The thermal reliability of
ss-CPCMs was tested by DSC and FT-IR after 100 cycles.
Thermal Properties Characterization
Multiscale Cu2-xS Pellet Characterization
Thermoelectric Performance Characterization
where 𝐶 𝑝 is the specific heat and 𝛿 is the density measured by the Archimedean principle.
Specific heat measurements were performed by the continuous scanning method under an argon atmosphere using a DSC 403 F3 apparatus (Netzsch). In the present case, the temperature dependence of 𝛿 was neglected. The dimensionless thermoelectric figure of merit ZT was calculated from the relationship ZT = α²T/ρλ with an experimental uncertainty estimated to be ±17%.
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