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Tecnai tf 20 feg tem

Manufactured by Thermo Fisher Scientific

The Tecnai TF-20 FEG/TEM is a transmission electron microscope (TEM) that utilizes a field emission gun (FEG) as the electron source. The core function of this instrument is to provide high-resolution imaging and analysis of materials at the nanoscale level.

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9 protocols using tecnai tf 20 feg tem

1

Ultrastructural Analysis of Cells

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The cells were fixed in 2.5% glutaraldehyde in 0.1 M sodium cacodylate buffer pH7.4 for 1 h. They were then rinsed in 0.1 M sodium cacodylate buffer, scraped and pelleted in 2% agar. Samples were trimmed and post-fixed in 1% osmium tetroxide for 1 h, en bloc stained in 2% uranyl acetate in maleate buffer pH5.2 for a further hour, rinsed then dehydrated in an ethanol series and infiltrated with resin (Embed812, Electron Microscopy Science) and cured overnight at 60 C°. Hardened blocks were cut using a Leica UC7 Ultramicrotome, 60 nm sections were collected onto formvar/carbon coated nickel grids and stained using 2% uranyl acetate and lead citrate. These were viewed FEI Tecnai Biotwin TEM at 80 kV. Images were taken using Morada CCD and iTEM (Olympus) software typically at 26,000 × magnification. For electron tomography, 250 nm sections were collected on formvar/carbon copper grids, 10 nm gold particles added on both sides of the grids (Utrect UMC). A tomography tilt series was acquired using SerialEM software on an FEI Tecnai TF20 FEG TEM at 200 kV. tomograms were reconstructed using IMOD software (University of Colorado, Boulder, CO).
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2

Characterization of LM Nanocapsules

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The structure and morphology of the prepared LM nanocapsules were observed using
high-resolution TEM (EM-002B; Topcon, Tokyo, Japan) with an accelerating voltage
of 120 kV. A small droplet of sample placed on a grid or
10 μl of sample solution (LM concentration:
100 μg ml−1) were
irradiated using a fibre-coupled CW laser at 785 nm for
3 min (spot diameter, ∼4 mm; maximum power:
1 W,
∼80 mW mm−2;
BRM-785-1.0-100-0.22-SMA; B&W Tek, Newark, DE, USA). The polymer shell
structure of nanocapsules and STEM/EDS mapping were performed by Nanoscience Co.
in Evans Analytical Group Company, Inc. (Tokyo, Japan). The samples were imaged
with a FEI Tecnai TF-20 FEG/TEM operated at 200 kV in bright-field
TEM mode, high-resolution (HR) TEM mode, and high-angle annular dark-field
(HAADF) STEM mode. The STEM probe size was 1–2 nm nominal
diameter. EDS mapping were acquired on Oxford INCA, Bruker Quantax EDS
system.
The hydrodynamic diameter of LM nanocapsules was examined by DLS (Photal
FPAR-1,000; Otsuka Electronics, Osaka, Japan). DLS diagram of laser-induced LM
nanocapsules was also measured. A 100 μl of sample solution
(LM concentration:
100 μg ml−1) was
irradiated using a fibre-coupled CW laser (maximum power: 1 W,
∼80 mW mm−2) at
785 nm for 1 h before DLS measurements.
The concentration of LM and carmofur in nanocapsules was estimated with a
ultraviolet–visible–NIR spectrophotometer (V-730 BIO; Jasco,
Tokyo, Japan).
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3

Cross-Sectional TEM Analysis of Indents

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In order to observe the deformation process beneath the indenter tip, as well as the shear plasticity, a bright field cross sectional transmission electron microscopy (XTEM) images are carried out on selected indents using FEI Tecnai TF-20 FEG/TEM operated at 200 kV in bright-field (BF). The TEM-ready sample was prepared using the in-situ FIB lift out technique on a FEI Dual Beam FIB/SEM. The sample was capped with sputtered C and e-Pt/I-Pt prior to milling to protect the surface of the area of interest.
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4

Structural Characterization of Nanomaterials

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For structural characterization, high-resolution X-ray scattering measurements (Grazing Incidence X-ray diffraction and X-ray reflection) were conducted using in-house X-ray diffraction (Smartlab XRD, Rigaku). Transmission electron microscopy (TEM)-ready samples were prepared using the in-situ FIB lift-out technique on an FEI Dual Beam FIB/SEM. The samples were capped with sputtered Ir and e-Pt/I-Pt prior to milling. The TEM lamella thickness was ~100 nm. The samples were imaged with a FEI Tecnai TF-20 FEG/TEM operated at 200 kV in bright-field (BF) TEM mode, high-resolution (HR) TEM mode, and high-angle annular dark-field (HAADF) STEM mode. The STEM probe size was 1-2 nm nominal diameter.
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5

Cross-Sectional TEM Imaging of Indents

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In order to observe the deformation process beneath the indenter tip, a bright field cross sectional transmission electron microscopy (XTEM) images of selected indents are carried out using FEI Tecnai TF-20 FEG/TEM operated at 200 kV in bright-field (BF). A TEM-ready sample was prepared using an in-situ FIB lift out technique using FEI Dual Beam FIB/SEM. The sample was capped with sputtered carbon (C) and e-Pt/I-Pt prior to milling to protect the surface of the area of interest.
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6

Nanoscale Characterization of Ferroelectric Thin Films

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TEM-ready sample is prepared using the in situ focused ion beam (FIB) lift out technique on an FEI Dual Beam FIB/SEM. The sample is capped with sputtered C and e-Pt/I-Pt prior to milling. The TEM lamella is ~100 nm. The sample is imaged by an FEI Tecnai TF-20 FEG/TEM at 200 kV in bright-field (BF) STEM mode and HAADF-STEM mode. The STEM probe size is 1–2 nm in nominal diameter. EDS mappings are acquired on an Oxford INCA Bruker Quantax EDS system. The PFM images is measured by an Bruker Multimode 8 equipment. The PFM tip is applied with a bias of −10 V to scan a square region. At the center of the scanned region, a bias of +10 V is applied to scan a square region, causing different regions to undergo different polarization inversion process. A Bruck D8 discover HRXRD is employed to estimate the Al/Sc ratio and epilayer crystal quality. The IV and IT curves are recorded by a PDA FS-Pro 380 semiconductor analyzer. During the IV and IT measurements, the maximum current is limited to 10−3 A to protect the device. The UV light is provided by a commercial UV LED with a peak wavelength of 355 nm. The LED is driven by a DH1766 DC Power Supply.
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7

Transmission Electron Microscopy Analysis of Thin Films

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Transmission electron
microscopy (TEM) analysis was performed by the Evans Analytical Group
(Sunnyvale, CA) on the thick films of Al2O3 and
AlWxFy, deposited
on silicon wafers. Cross-sectional TEM samples were prepared using
the in situ focused ion beam (FIB) liftout technique on an FEI Strata
DualBeam FIB/scanning electron microscope. The samples were capped
with a protective layer of carbon prior to FIB milling and were imaged
with an FEI Tecnai TF-20 FEG/TEM operated at 200 kV.
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8

TEM Characterization of FIB-Prepared Samples

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The TEM-ready samples were prepared using the in-situ FIB lift out technique on a FEI Dual Beam FIB/SEM. The samples were capped with sputtered C and e-Pt/I-Pt prior to milling. The TEM lamella thickness was ~100 nm. The samples were imaged with a FEI Tecnai TF-20 FEG/TEM operated at 200 kV in bright-field (BF) TEM mode, high-resolution (HR) TEM mode, and high-angle annular dark-field (HAADF) STEM mode. The STEM probe size was 1–2 nm nominal diameter. EDS spectra were acquired on Oxford INCA, Bruker Quantax EDS system.
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9

Transmission Electron Microscopy Analysis

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A lamella of the annealed sample was
sent to EurofinsEAG for commercial TEM analysis. Images were collected
using bright field (BF) and dark field (DF) STEM, TEM, and high-resolution
(HR) TEM techniques using a FEI Tecnai TF-20 FEG/TEM operated at 200
kV, and energy dispersive X-ray spectroscopy (EDX) spectra were acquired
using an Oxford INCA, Bruker Quantax EDS system. Crystal structure
was measured by nanobeam diffraction. The TEM-based measurements of
the as-implanted sample were performed using a new Thermo FEI Talos
F200I TEM recently installed at the University of Surrey. Because
of installation time, measurements were performed 7–10 months
after the implants were carried out. EDX spectra were acquired using
a Bruker X-Flash system. EDX was used to map the location of Si and
Al in the samples displayed in this paper as false color images to
indicate the predominant element.
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