MnCO3, K2CO3, Na2SO4, acetylene black, poly (vinylidene fluoride) (PVDF) and nickel foil were purchased from Alfa Aesar. 6N hydrochloric acid (HCl) solution and sodium hydroxide (NaOH) were obtained from Fisher Scientific. The tetrabutylammonium hydroxide solution (TBAOH, 40 wt% in H2O) and N-methyl-2-pyrrolidone (NMP) were purchased from Sigma-Aldrich. All reagents were used as received without further purification.
Nickel foil
Manufactured by Thermo Fisher Scientific
Sourced in United States
Nickel foil is a thin, flexible sheet of pure nickel metal. It has a silvery-white appearance and is highly resistant to corrosion. Nickel foil is used in various industrial and scientific applications due to its unique physical and chemical properties.
Automatically generated - may contain errors
Lab products found in correlation
Acetylene black, by Thermo Fisher Scientific (1 mentions)
Tetrabutylammonium hydroxide solution, by Merck Group (1 mentions)
Sodium hydroxide (naoh), by Thermo Fisher Scientific (1 mentions)
Mnco3, by Thermo Fisher Scientific (1 mentions)
6n hydrochloric acid hcl solution, by Thermo Fisher Scientific (1 mentions)
Na2so4, by Thermo Fisher Scientific (1 mentions)
K2co3, by Thermo Fisher Scientific (1 mentions)
N methyl 2 pyrrolidone, by Merck Group (1 mentions)
Ni no3 2 6h2o, by Merck Group (1 mentions)
Fe no3 3 9h2o, by Merck Group (1 mentions)
Urea, by Merck Group (1 mentions)
6 protocols using nickel foil
1
Fabrication of MnCO3 Battery Electrodes
2
Electrodeposition of Cu-Ni Dendrites on Porous Foams
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Example 8
The diverging Cu—Ni dendrites were electrodeposited on the obtained porous Cu—Ni foams at a potential of −1.2 V (vs. Ag/AgCl) for 150 coulombs from an electrolyte made of nickel sulfamate [Ni(SO3NH2)2, 0.5M], nickel chloride (NiCl2, 0.1M), copper chloride (CuCl2, 0.0025M), and boric acid (H3BO3, 0.323M) with nickel foil (Alfa Aesar, Mass., USA) working as the counter electrode. The electrodeposition was sequentially repeated four times with the porous Cu—Ni foam substrate rotated upside-down each time to ensure an even coverage of the dendrites. The electrolyte was also replaced every two depositions to replenish the copper ions available for the formation of diverging branches. Upon completion of all four electrodepositions, the Cu—Ni foams were rinsed with deionized water and annealed at 1000° C. in a gas mixture (H2, 5 sccm and N2, 50 sccm) for 5 min to enhance the adhesion between the Cu—Ni dendrites and Cu—Ni foam struts.
3
Synthesis of NiFe-LDHs on Nickel Foil
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NiFe-LDHs were synthesized using a hydrothermal method, where 0.3 g Ni(NO3)2·6H2O (Aldrich, 99.99%), 0.36 g Fe(NO3)3·9H2O (Aldrich, 98%), and 0.3 g urea (Aldrich, 99%) were dissolved in 80 ml deionized water. Nickel foil (Alfa Aesar, 99.5%, 100 μm thickness) was cleaned by ultrasonication in acetone, isopropyl alcohol, and ethanol for 3 min each. The aqueous solution and Nickel foil were transferred to a 100 ml Teflon-lined autoclave, which was placed at 120 °C for 12 h and then cooled to room temperature. The foil was washed with deionized water and dried at 60 °C overnight. After connecting a copper wire to the prepared OPVs with silver paste and epoxy, a NiFe-LDH/Ni foil was loaded on the electrode with GaIn eutectic (Aldrich, 99.99%) between them. Finally, an epoxy bond was applied to fix and encapsulate the electrode and dried at room temperature overnight (active area: 0.5 cm2).
4
Cu-Ni Dendrite Deposition on Porous Foams
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Example 8
The diverging Cu—Ni dendrites were electrodeposited on the obtained porous Cu—Ni foams at a potential of −1.2 V (vs. Ag/AgCl) for 150 coulombs from an electrolyte made of nickel sulfamate [Ni(SO3NH2)2, 0.5M], nickel chloride (NiCl2, 0.1M), copper chloride (CuCl2, 0.0025M), and boric acid (H3BO3, 0.323M) with nickel foil (Alfa Aesar, MA, USA) working as the counter electrode. The electrodeposition was sequentially repeated four times with the porous Cu—Ni foam substrate rotated upside-down each time to ensure an even coverage of the dendrites. The electrolyte was also replaced every two depositions to replenish the copper ions available for the formation of diverging branches. Upon completion of all four electrodepositions, the Cu—Ni foams were rinsed with deionized water and annealed at 1000° C. in a gas mixture (H2, 5 sccm and N2, 50 sccm) for 5 min to enhance the adhesion between the Cu—Ni dendrites and Cu—Ni foam struts.
5
CVD Synthesis of Multilayer Graphene
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MLG was synthesized by CVD (planarTECH CVD) on 25-μm-thick nickel foils (Alfa Aesar, 12722). First, nickel foil substrate was heated to the growth temperature of 1050 °C under 100 sccm H2, and 100 sccm Ar flow and annealed at 1050 °C for 20 minutes. Then, 35 sccm CH4flow was used as carbon precursor for 15 minutes at atmospheric pressure with addition to 100 sccm H2, and 100 sccm Ar flow at 1050 °C. Lastly, the sample was cooled down to the room temperature quickly under 100 sccm H2 and 100 sccm Ar flow. Thickness of the MLG is ~150 layers.
6
CVD Synthesis of Multilayer Graphene
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