Processing was done with a Leica EM TP processor (Leica Microsystems Inc., North
Deerfield, IL). Samples were rinsed with buffer, post-fixed in 2% osmium
tetroxide in phosphate buffer, rinsed in distilled water and dehydrated in an
ethanol series transitioning into propylene oxide. The samples were then
infiltrated with Poly/Bed 812 epoxide resin (Polysciences). After
polymerization, selected blocks were trimmed and semithin sections
(approximately 0.5 μm thick) were cut, mounted on glass slides, stained
with 1% toluidine blue in 1% sodium borate, and examined with a light microscope
to ascertain areas of interest. After trimming block faces down to areas of
interest, ultrathin sections (70–90 nm thick) were subsequently cut,
placed on 100 mesh formvar copper grids and stained with uranyl acetate and lead
citrate. Digital images were captured with an Olympus Mega View III side mount
camera attached to an FEI Tecnai 120KV transmission electron microscope.