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EGaIn is a laboratory equipment product designed for precise liquid metal deposition and manipulation. It is a liquid metal alloy composed of gallium and indium, offering unique properties for various research and experimental applications. The core function of EGaIn is to enable controlled handling and deposition of liquid metal for specialized research purposes.

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2 protocols using egain

1

Fabrication of EGaIn-SEBS Composite Films

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The EGaIn-SEBS composite film was prepared using the following procedure. First, 180 mg of SEBS (Tuftec™ H1062, Asahi Kasei Co., Chiyoda, Tokyo, Japan) was dissolved in 2 mL of toluene (Sigma-Aldrich, St. Louis, MO, USA) by stirring for 6 h at 200 rpm. Subsequently, 700 mg of EGaIn (12478, Alfa Aesar, Haverhill, MA, USA) was added to 2 mL of SEBS solution in a conical tube (Dongnam Chemical, Seoul, Republic of Korea). To homogenize the particles, the composite solution was subjected to tip sonication using a VCX–750 (Sonics & Materials Inc., Newtown, CT, USA) operating at a power of 300 W power for 10 min. The resulting EGaIn-SEBS solution was then drop-cast onto 3 cm × 3 cm octadecyl trichlorosilane (OTS)-treated glass substrates and left to evaporate at room temperature for 6 h. Finally, the composite was peeled off from the glass surface to complete the fabrication process. The LM particles in the drop-cast composite solution sank to the bottom during the evaporation process, thereby making the under and upper sides of the composite conductive and insulating parts, respectively.
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2

Fabrication of Conductive EGaIn-SEBS Composite

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To fabricate the EGaIn-SEBS composite, firstly, 180 mg of SEBS (Tuftec™ H1062, Asahi Kasei Co., Ltd., Tokyo, Japan) was dissolved in 1.5 mL of toluene (Sigma-Aldrich, Burlington, MA, USA). Subsequently, 400 mg, 700 mg, and 1 g of EGaIn (12478, Alfa Aesar, Ward Hill, MA, USA) were added to the solution, and tip sonication (VCX-750, Sonics & Materials Inc., Newtown, Connecticut, USA) was performed for 10 min at 300-W power. The EGaIn-SEBS solution was drop-casted in 2 cm × 2 cm glasses and evaporated at room temperature for 6 h to complete a homogeneous composite. Ag flakes (AgFs, DSF-500MWZ-S, Daejoo Electronic Materials Co., Ltd., Gyeonggi-do, South Korea) were used as solid-state fillers for comparison with EGaIn, which is a liquid-state filler. A total of 700 mg of AgFs was added to the toluene in which SEBS was dissolved, and the AgF-SEBS solution was dispersed well using a vortex mixer (MaXshake™ VM30, Daihan Scientific Co., Ltd., Gangwon-do, South Korea). Thereafter, the AgF-SEBS composite was fabricated in the same way as the aforementioned process. Finally, the microscopic structure and EDS (Energy Dispersive X-Ray Spectrometer) mapping of the composites were analyzed using FE-SEM (JSM-IT800, JEOL Co., Ltd., Tokyo, Japan).
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