Electrodeposition of Ni-Cu Dendrites on Porous Ni Foam

Example 2

A planar conducting substrate, such as Ni and Cu foils, or a 3-D Ni foam was immersed in 1M H₂SO₄ to remove the oxide layer and then transferred to Ni—Cu electrolyte (0.1 M nickel chloride, 0.5 M nickel sulfamate, 0.0025 M copper chloride and 0.323 M boric acid). After electrodeposition at a current of −350 mA for 150 coulombs, the sample was turned upside down, and the surface pointing to the reference electrode was also reversed. Then another deposition is continued. Totally four such depositions were carried out on each sample. Next, the obtained Ni—Cu dendrites on porous nickel foam were enforced by annealing in nitrogen (50 SCCM) and hydrogen (5 SCCM) gas atmosphere at the temperature of 1000° C. for 5 min.