Particles are produced using a surface acoustic wave (SAW)-based spray-drying method. The device is composed of a LiNbO3 wafer with a size of 2 × 3 cm2 onto which an Interdigital transducer (IDT) finger cross pattern is sputtered as described previously.30 The wafer is connected to a PowerSAW Generator (Belektronig GmbH) via a Printed Circuit Board (PCB). The solution is delivered onto the chip through a poly(dimethylsiloxane) (PDMS) (Sylgard 184, Dow Corning) based microfluidic channel that is bound to the piezoelectric wafer using oxygen plasma. The solution is injected into the PDMS-based channel with a width and height of 100 μm using a volume-controlled syringe pump (Cronus Sigma 1000, Labhut) at a flow rate of 1.5 ml h−1. The powerSAW Generator is operated at 3.3 W. The dried particles are collected on one side polished silicon wafers for further characterization.
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SAW-based Spray-drying Particle Production
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Corresponding Organization : École Polytechnique Fédérale de Lausanne
Other organizations : Firmenich (Switzerland)
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Variable analysis
independent variables
- Solution flow rate (1.5 ml h^-1)
- Power of the PowerSAW Generator (3.3 W)
- Characteristics of the dried particles collected on silicon wafers
- Size of the LiNbO3 wafer (2 × 3 cm^2)
- Interdigital transducer (IDT) finger cross pattern sputtered on the wafer
- Microfluidic channel dimensions (width and height of 100 μm)
- PDMS-based microfluidic channel bound to the piezoelectric wafer using oxygen plasma
- Syringe pump used to inject the solution into the PDMS-based channel
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