The multilayered NW networks have been grown at RT by electrodeposition into the 3D porous PC templates from a single sulfate bath using potentiostatic control and a pulsed electrodeposition technique (38 ). For these experiments, we used an Ag/AgCl reference electrode and a Pt counter electrode. To prepare the CoNi/Cu interconnected NW networks, the composition of the electrolyte was 2.3 M NiSO4 · 6H2O + 0.4 M CoSO4 · 7H2O + 15 mM CuSO4 · 5H2O + 0.5 M H3BO3, and the deposition potential was alternatively switched between −1 V to deposit equiatomic CoNi alloy layer (containing approximately 5% Cu impurity), and −0.4 V to deposit almost pure Cu layers (39 ). Following a procedure described elsewhere (38 ), the deposition rates of each metals were determined from the pore filling time. According to this calibration, the deposition time was adjusted to 300 ms and 12 s for the CoNi and Cu layers, respectively, and the estimated average thickness of the bilayer was ~15 nm, with approximately the same thicknesses for the CoNi and Cu layers. The morphology of the nanostructured interconnected NW networks was characterized using a high-resolution field emission SEM JEOL 7600F equipped with an energy-dispersive x-ray analyzer. For the electron microscopy analysis, we removed the PC template by chemical dissolution using dichloromethane. For conducting magnetotransport measurements, the cathode was locally removed by plasma etching to create a two-probe design suitable for electric measurements, with the flow of current restricted along the NW segments, thus perpendicular to the plane of the layers.
Fabrication of Multilayered Nanostructured Interconnected Nanowire Networks
The multilayered NW networks have been grown at RT by electrodeposition into the 3D porous PC templates from a single sulfate bath using potentiostatic control and a pulsed electrodeposition technique (38 ). For these experiments, we used an Ag/AgCl reference electrode and a Pt counter electrode. To prepare the CoNi/Cu interconnected NW networks, the composition of the electrolyte was 2.3 M NiSO4 · 6H2O + 0.4 M CoSO4 · 7H2O + 15 mM CuSO4 · 5H2O + 0.5 M H3BO3, and the deposition potential was alternatively switched between −1 V to deposit equiatomic CoNi alloy layer (containing approximately 5% Cu impurity), and −0.4 V to deposit almost pure Cu layers (39 ). Following a procedure described elsewhere (38 ), the deposition rates of each metals were determined from the pore filling time. According to this calibration, the deposition time was adjusted to 300 ms and 12 s for the CoNi and Cu layers, respectively, and the estimated average thickness of the bilayer was ~15 nm, with approximately the same thicknesses for the CoNi and Cu layers. The morphology of the nanostructured interconnected NW networks was characterized using a high-resolution field emission SEM JEOL 7600F equipped with an energy-dispersive x-ray analyzer. For the electron microscopy analysis, we removed the PC template by chemical dissolution using dichloromethane. For conducting magnetotransport measurements, the cathode was locally removed by plasma etching to create a two-probe design suitable for electric measurements, with the flow of current restricted along the NW segments, thus perpendicular to the plane of the layers.
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Other organizations : UCLouvain
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Variable analysis
- Irradiation angle (-25° and +25° with respect to the normal axis of the film plane)
- Thickness of the Au film (400 nm and 750 nm)
- Deposition potential (-1 V for CoNi alloy layer and -0.4 V for Cu layer)
- Deposition time (300 ms for CoNi layer and 12 s for Cu layer)
- Pore diameter (80 nm and 105 nm)
- Volumetric porosity (3% and 22%)
- Composition of the multilayered NW networks (CoNi alloy and Cu layers)
- Thickness of the PC film (22 μm)
- Thickness of the Cr adhesion layer (3 nm)
- Temperature (room temperature)
- Not specified
- Not specified
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