Germanium Thin Film Growth and Annealing
Corresponding Organization : University of Tsukuba
Protocol cited in 4 other protocols
Variable analysis
- Substrate temperature during deposition (T_d), ranging from 50 to 200 °C
- Germanium (Ge) thin film deposition on SiO2 glass substrates
- Deposition rate of 1.0 nm/min
- Deposition time of 100 min
- Ge source purity of 99.999%
- Base pressure of 5 × 10^-7 Pa in the molecular beam deposition system
- Annealing conditions: 375 °C for 140 h, 400 °C for 40 h, and 450 °C for 5 h in N2 atmosphere
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